5962-8984105LA Cypress Semiconductor Corp, 5962-8984105LA Datasheet - Page 10

• Manufacturer Part Number: 5962-8984105LA
• Manufacturer: Cypress Semiconductor Corp

Specifications of 5962-8984105LA

• Process Technology: CMOS
• # Macrocells: 10
• # I/os (max): 10
• Frequency (max): 83.3MHz
• Propagation Delay Time: 15ns
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 24
• Supply Current: 130mA
• Lead Free Status / RoHS Status: Not Compliant

Ordering Information
MILITARY SPECIFICATIONS
Group A Subgroup Testing
DC Characteristics
V
V
V
V
I
I
I
(mA)
IX
OZ
CC
130
150
150
120
120
120
120
I
90
90
90
OH
OL
IH
IL
CC
Parameter
(ns)
t
7.5
10
10
10
15
15
15
25
25
25
PD
(ns)
7.5
7.5
7.5
15
15
15
t
5
6
6
6
S
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
(ns)
t
10
10
10
15
15
15
CO
Subgroups
5
7
7
7
PALC22V10D-7JC
PALC22V10D-7PC
PALC22V10D-10JC
PALC22V10D-10PC
PALC22V10D-10JI
PALC22V10D-10PI
PALC22V10D-10DMB
PALC22V10D-10KMB
PALC22V10D-10LMB
PALC22V10D-15JC
PALC22V10D-15PC
PALC22V10D-15JI
PALC22V10D-15PI
PALC22V10D-15DMB
PALC22V10D-15KMB
PALC22V10D-15LMB
PALC22V10D-25JC
PALC22V10D-25PC
PALC22V10D-25JI
PALC22V10D-25PI
PALC22V10D-25DMB
PALC22V10D-25KMB
PALC22V10D-25LMB
Ordering Code
Package
Name
D14
D14
D14
10
P13
P13
P13
K73
L64
P13
P13
K73
L64
P13
P13
K73
L64
J64
J64
J64
J64
J64
J64
J64
Switching Characteristics
t
t
t
t
Document #: 38-00185-H
PD
CO
S
H
Parameter
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
28-Lead Plastic Leaded Chip Carrier
24-Lead (300-Mil) Molded DIP
24-Lead (300-Mil) CerDIP
24-Lead Rectangular Cerpack
28-Square Leadless Chip Carrier
Package Type
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
Subgroups
PALC22V10D
Commercial
Commercial
Industrial
Military
Commercial
Industrial
Military
Commercial
Industrial
Military
Operating
Range