5962-9759902QXC QP SEMICONDUCTOR, 5962-9759902QXC Datasheet - Page 3

• Manufacturer Part Number: 5962-9759902QXC
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-9759902QXC

• Lead Free Status / RoHS Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
Unless otherwise specified, the issues of these documents are those cited in the solicitation.
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
22201; http://www.jedec.org.)
_______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
2/ Minimum dc input voltage is -0.5 V, which may overshoot to -2.0 V for periods less than 20 ns. Maximum dc voltage on
3/ Must withstand the added P
4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
5/ All voltage values in this drawing are with respect to V
1.3 Absolute maximum ratings. 1/
1.4 Recommended operating conditions. 5/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
(Copies of these documents are available online at
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA
maximum levels may degrade performance and affect reliability.
output pins is V
accordance with method 5004 of MIL-STD-883.
DEPARTMENT OF DEFENSE SPECIFICATION
DEPARTMENT OF DEFENSE STANDARDS
DEPARTMENT OF DEFENSE HANDBOOKS
Supply voltage range (V
Programming supply voltage range (V
DC input voltage range ....................................................
Maximum power dissipation ............................................
Lead temperature (soldering, 10 seconds) ......................
Thermal resistance, junction-to-case (θ
Junction temperature (T
Storage temperature range .............................................
Endurance .....................................................................
Data retention ..................................................................
Case operating temperature range (T
Supply voltage relative to ground (V
Ground voltage (GND) .................................................... 0 V dc
Input high voltage (V
Input low voltage (V
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
MIL-STD-883
MIL-STD-1835 -
MIL-HDBK-103 -
MIL-HDBK-780 -
JEDEC Standard EIA/JESD78
Case outline X ...............................................................
Case outline Y and Z .....................................................
DEFENSE SUPPLY CENTER COLUMBUS
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
CC
+ 0.5 V, which may overshoot to +7.0 V for periods less than 20 ns under load conditions.
STANDARD
-
IL
IH
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
) ...................................................... 0.8 V dc maximum
) .................................................... 2.0 V dc minimum
CC
J
) ................................................
) .............................................
D
due to short circuit test (e.g., I
-
CC
C
PP
) ........................... +4.5 V dc minimum to +5.5 V dc maximum
IC Latch-Up Test.
) .......................... -55°C to +125°C
JC
) ........................
):
http://assist.daps.dla.mil/quicksearch/
SS
.
OS
-2.0 V dc to +7.0 V dc
-2.0 V dc to +13.5 V dc 2/
-2.0 V dc to +7.0 V dc 2/
2.5 W 3/
+260°C
See MIL-STD-1835
+175°C 4/
25 erase/write cycles (minimum)
10 years (minimum)
7.2° C/W
-65°C to +150°C
).
SIZE
A
REVISION LEVEL
or from the Standardization
B
SHEET
5962-97599
3