KC80526LY400128 Intel, KC80526LY400128 Datasheet - Page 39

• Manufacturer Part Number: KC80526LY400128
• Manufacturer: Intel

Specifications of KC80526LY400128

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

5.3
5.3.1
Three mounting holes are available for securing the module
to the system base. See Figure 11 for mounting hole
locations. These hole locations and board edge clearances
will remain fixed for all Intel mobile modules. Intel
recommends that all three mounting holes are used to
ensure long term mechanical reliability and EMI integrity of
the system.
The board edge clearance includes a 0.762 millimeters
(0.030 inches) wide EMI containment ring around the
perimeter of the module. This ring is on each layer of the
module PCB and is grounded. On the surface of the module,
the metal is exposed for EMI shielding purposes. The hole
Physical Support
Mounting Requirements
Figure 15. Thermal Transfer Plate (B)
patterns placed on the module also have a plated
surrounding ring, which can be used with a metal standoff for
EMI shielding purposes. Standoffs should be used to provide
support for the installed Celeron processor mobile module.
The distance from the bottom of the module PCB to the top
of the OEM system electronics board with the connectors
mated is 4.0 millimeters +0.16 millimeters / -0.13 millimeters.
However the warpage of the baseboard can vary and should
be calculated into the final dimensions of the standoffs used.
All calculations can be made with the Intel
Standoff/Receptacle Height Spreadsheet. Information on this
spreadsheet can be obtained from your local Intel
representative. Figure 16 shows the standoff support hole
patterns, the board edge clearance, the dimensions of the
EMI containment ring, and the keep-out area.
Intel Celeron
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
Processor Mobile Module MMC-1
MMC-1
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