EW80314GS Q 099 Intel, EW80314GS Q 099 Datasheet - Page 29

• Manufacturer Part Number: EW80314GS Q 099
• Manufacturer: Intel

Specifications of EW80314GS Q 099

• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

6.
Issue:
Affected Docs: Intel
7.
Issue:
Affected Docs: Intel
Intel
Figure 1. Power-Sequencing Requirements
®
80314 I/O Processor Companion Chip Specification Update
Additional nominal and maximum power data; correction of power
dissipation values
Table 29 (in Section 4.1 of the Intel
list nominal and maximum power consumption for each voltage rail. The following entries are to
be added to Table 29:
In addition, the power dissipation values in Table 22 must be updated from 2.4 typ./4.2 max.
(predicted) to 2.456 typ./4.226 max. (actual).
Power-sequencing requirement
The power-up and power-down sequences of the 80314 1.2 V/2.5 V/3.3 V supply rails has been
revised from version 003 and 004 of this specification update. The power sequencing requirements
initially presented in version 003 were designed to avoid transient current draw that could appear
on the 2.5 V/3.3 V supply rails. Further investigation has determined that no current transients
occur when the 1.2 V supply is ramped first. In addition, it is acceptable to ramp the 1.2 V supply
after the 2.5 V and 3.3 V supplies as long as the lag is less than or equal to 20 mS. When the 1.2 V
rail lags the 2.5 V and/or 3.3 V rail, transient currents of up to 2 A/V
occur on the supplies until V
20 ms before or any time after the 3.3 V/2.5 V supplies power down. These requirements are
illustrated in
Intel
PVCC33
PVCC25
PVCC12
Symbol
®
®
®
80314 I/O Processor Companion Chip Datasheet
80314 I/O Processor Companion Chip Design Guide (Section 11.1)
80314 I/O Processor Companion Chip Datasheet
Volts
Volts
3.3 V supply power
2.5 V supply power
1.2 V supply power
Figure
1.2
1.2
3.3
3.3
2.5
2.5
0.5
0.5
• Vdd 3.3 and Vdd 2.5 can come up in either order relative to each other
• Vdd 3.3 and Vdd 2.5 can come up in either order relative to each other
• Vdd 1.2 can proceed V3.3 and Vdd 2.5 or lag up to 20mS max
• Vdd 1.2 can proceed V3.3 and Vdd 2.5 or lag up to 20mS max
• If Vdd 1.2 lags Vdd 3.3 and/or Vdd 2.5 transient currents of up to 2A/Vdd 2.5 and 4A/Vdd 3.3 occur
• If Vdd 1.2 lags Vdd 3.3 and/or Vdd 2.5 transient currents of up to 2A/Vdd 2.5 and 4A/Vdd 3.3 occur
• 1.2V can power down before 3.3V/2.5V by no more than 20ms or any time after 3.3V/2.5V.
• 1.2V can power down before 3.3V/2.5V by no more than 20ms or any time after 3.3V/2.5V.
on the supplies until Vdd 1.2 >= ~0.6v
on the supplies until Vdd 1.2 >= ~0.6v
Parameter
1.
DD
Vdd 3.3 and Vdd 2.5
Vdd 3.3 and Vdd 2.5
1.2
in either order
in either order
®
>= ~0.6 V. The 1.2 V supply can power down no more than
80314 I/O Processor Companion Chip Datasheet), does not
1430
Min.
756
270
Time
Time
10mS max
10mS max
1710
1907
Max.
609
Units
mW
mW
mW
Specification Changes
DD2.5
and 4 A/V
Vdd3.3
Vdd3.3
Vdd2.5
Vdd2.5
Vdd1.2
Vdd1.2
Notes
DD3.3
can
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