MCIMX31LCVKN5D Freescale, MCIMX31LCVKN5D Datasheet - Page 5

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MCIMX31LCVKN5D

Manufacturer Part Number
MCIMX31LCVKN5D
Description
Manufacturer
Freescale
Datasheet

Specifications of MCIMX31LCVKN5D

Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant

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Quantity
Price
Part Number:
MCIMX31LCVKN5D
Manufacturer:
Freescale Semiconductor
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10 000
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Manufacturer:
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2.1.1
The ARM1136JF-S complex includes 16 KB Instruction and 16 KB Data L1 caches. It connects to the
MCIMX31 L2 unified cache through 64-bit instruction (read-only), 64-bit data read/write (bi-directional),
and 64-bit data write interfaces.
The embedded 16K SRAM can be used for audio streaming data to avoid external memory accesses for
the low-power audio playback, for security, or for other applications. There is also a 32-KB ROM for
bootstrap code and other frequently-used code and data.
A ROM patch module provides the ability to patch the internal ROM. It can also initiate an external boot
by overriding the boot reset sequence by a jump to a configurable address.
Table 2
Freescale Semiconductor
ARM11 or
ARM1136
Acronym
Core
Instruction and data memory management units (MMUs), managed using micro TLB structures
backed by a unified main TLB
Instruction and data L1 caches, including a non-blocking data cache with Hit-Under-Miss
Virtually indexed/physically addressed L1 caches
64-bit interface to both L1 caches
Write buffer (bypassable)
High-speed Advanced Micro Bus Architecture (AMBA)
Vector Floating Point co-processor (VFP) for 3D graphics and other floating-point applications
hardware acceleration
ETM
shows information about the MCIMX31 core in tabular form.
ARM1136
Platform
Memory System
Name
Core
and JTAG-based debug support
The ARM1136™ Platform consists of the ARM1136JF-S core, the ETM
real-time debug modules, a 6 x 5 multi-layer AHB crossbar switch (MAX), and
a Vector Floating Processor (VFP).
The MCIMX31 provides a high-performance ARM11 microprocessor core and
highly integrated system functions. The ARM Application Processor (AP) and
other subsystems address the needs of the personal, wireless, and portable
product market with integrated peripherals, advanced processor core, and
power management capabilities.
MCIMX31/MCIMX31L Technical Data, Rev. 4.3
Table 2. MCIMX31 Core
Brief Description
Functional Description and Application Information
L2 interface
• 16 Kbyte Instruction
• 16 Kbyte Data
• 128 Kbyte L2 Cache
• 32 Kbyte ROM
• 16 Kbyte RAM
Integrated Memory
Cache
Cache
Includes
5

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