MPC855TZQ50D4 Freescale, MPC855TZQ50D4 Datasheet - Page 14

• Manufacturer Part Number: MPC855TZQ50D4
• Manufacturer: Freescale

Specifications of MPC855TZQ50D4

• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 50MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465/3.6V
• Operating Supply Voltage (min): 2/3.135V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Not Compliant

Layout Practices
where:
The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40 gauge
type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over 1 mm of wire extending from the junction. The thermocouple wire is
placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
7.6
8
Each V
GND pin should likewise be provided with a low-impedance path to ground. The power supply pins drive
distinct groups of logic on the chip. The V
four 0.1 µF-bypass capacitors located as close as possible to the four sides of the package. The capacitor
leads and associated printed circuit traces connecting to chip V
an inch per capacitor lead. A four-layer board employing two inner layers as V
recommended.
All output pins on the MPC860 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize undershoot and reflections caused by these fast output
switching times. This recommendation particularly applies to the address and data buses. Maximum PC
trace lengths of 6 inches are recommended. Capacitance calculations should consider all device loads as
well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes
especially critical in systems with higher capacitive loads because these loads create higher transient
currents in the V
Special care should be taken to minimize the noise levels on the PLL supply pins.
14
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) Specifications
(Available from Global Engineering Documents)
JEDEC Specifications
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance
DD
Ψ
T
P
Automotive Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
and Its Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999,
pp. 212–220.
Layout Practices
D
T
JT
References
pin on the MPC860 should be provided with a low-impedance path to the board’s supply. Each
= thermocouple temperature on top of package
= power dissipation in package
= thermal characterization parameter
CC
and GND circuits. Pull up all unused inputs or signals that will be inputs during reset.
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
DD
power supply should be bypassed to ground using at least
DD
and GND should be kept to less than half
[phone]
800-854-7179 or
303-397-7956
http://www.jedec.org
CC
and GND planes is
Freescale Semiconductor