LH7A404N0F092B3 Sharp Electronics, LH7A404N0F092B3 Datasheet - Page 70

LH7A404N0F092B3

Manufacturer Part Number
LH7A404N0F092B3
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH7A404N0F092B3

Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Processing Unit
Microprocessor
Operating Supply Voltage (min)
2V
Operating Supply Voltage (typ)
2.1V
Operating Supply Voltage (max)
2.2V
Package Type
LFBGA
Pin Count
324
Mounting
Surface Mount
Rad Hardened
No
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LH7A404N0F092B3
Manufacturer:
TI
Quantity:
101
Part Number:
LH7A404N0F092B3
Manufacturer:
Sharp Microelectronics
Quantity:
135
Part Number:
LH7A404N0F092B3,55
Manufacturer:
NXP Semiconductors
Quantity:
10 000
LH7A404
PACKAGE SPECIFICATIONS
70
LFBGA324: plastic low profile fine-pitch ball grid array package; 324 balls
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT1021-1
OUTLINE
VERSION
max
1.7
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
M
Y
V
T
P
K
H
F
D
B
1.35
1.15
A
W
U
R
N
L
G
E
C
A
J
2
IEC
1
2
0.5
0.4
b
3
Figure 55. Package outline SOT1021-1 (LFBGA324)
4
5
17.1
16.9
D
e
6
7
8
17.1
16.9
9
JEDEC
E
10
e
D
11
1
12
REFERENCES
0.8
13
e
1/2 e
14
15
NXP Semiconductors
0
15.2
16
e
1
17
18
b
19
15.2
JEITA
e 2
20
scale
5
0.15
1/2 e
v
B
e
∅ w
∅ v
e
A
E
0.08
2
w
M
M
10 mm
C
C
0.12
A
y
B
A
0.1
y
1
A
2
y
1
A
PROJECTION
1
EUROPEAN
C
detail X
32-Bit System-on-Chip
C
X
Product data sheet
y
ISSUE DATE
07-07-07
07-07-07
SOT1021-1

Related parts for LH7A404N0F092B3