5962-9093201MEA QP SEMICONDUCTOR, 5962-9093201MEA Datasheet - Page 11

• Manufacturer Part Number: 5962-9093201MEA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-9093201MEA

• Lead Free Status / RoHS Status: Not Compliant

DSCC FORM 2234
APR 97
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
4.2.1 Additional criteria for device class M.
4.2.2 Additional criteria for device classes Q and V.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
4.4.1 Group A inspection.
b.
a.
b.
a.
b.
c.
a.
c.
DEFENSE SUPPLY CENTER COLUMBUS
Subgroups 4, 5, 6, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level
(2) T
Interim and final electrical test parameters shall be as specified in table II herein.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
Tests shall be as specified in table II herein.
For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V,
subgroups 7 and 8 shall include verifying the functionality of the device.
MICROCIRCUIT DRAWING
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015.
COLUMBUS, OHIO 43216-5000
A
= +125 C, minimum.
STANDARD
SIZE
A
REVISION LEVEL
B
SHEET
5962-90932
11