MC33580BAPNA Freescale, MC33580BAPNA Datasheet - Page 34

• Manufacturer Part Number: MC33580BAPNA
• Manufacturer: Freescale

Specifications of MC33580BAPNA

• Switch Type: High Side
• Power Switch Family: MC33580
• Input Voltage: 6 to 27V
• Power Switch On Resistance: 30mOhm
• Number Of Outputs: 4
• Mounting: Surface Mount
• Supply Current: 20mA
• Package Type: Power QFN
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Pin Count: 24
• Lead Free Status / RoHS Status: Compliant

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
Introduction
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the datasheet.
Packaging and Thermal Considerations
independently heating with P
T
temperature while only heat source 1 is heating with P
reference temperature while heat source 2 is heating with P
R
This methodology is not meant to and will not predict the performance of a package in an application-specific environment. Stated
values were obtained by measurement and simulation according to the standards listed below.
34
33580
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 3.0)
J1
θ
Standards
Table 21. Thermal Performance Comparison
Notes:
J21
This thermal addendum is provided as a supplement to the MC33580 technical
This package is a dual die package. There are two heat sources in the package
For m, n = 1, R
For m = 1, n = 2, R
The stated values are solely for a thermal performance comparison of one package to another in a standardized environment.
R
R
R
R
and T
θ JA mn
θ JB mn
θ JA mn
θ JC mn
1.
2.
3.
4.
5.
Resistance
and R
Thermal
Per JEDEC JESD51-2 at natural convection, still air
condition.
2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
J2
(1),
(2),
(1),
(5)
, and a thermal resistance matrix with R
θ
J22
(2)
(3)
(4)
T
T
J1
J2
,
respectively.
θ
JA11
=
θ
JA12
is the thermal resistance from Junction 1 to the reference
1 = Power Chip, 2 = Logic Chip [°C/W]
m = 1,
R
n = 1
R
<0.5
20
53
θJA11
θJA21
6
is the thermal resistance from Junction 1 to the
1
and P
R
R
θJA12
θJA22
m = 1, n = 2
m = 2, n = 1
2
. This results in two junction temperatures,
2.0
0.0
16
40
.
P
P
1
2
θ
JA mn
m = 2,
n = 2
1
1.0
39
26
73
.
.
2
. This applies to
Note: Recommended via diameter is 0.5 mm. PTH (plated through
hole) via must be plugged / filled with epoxy or solder mask in orde
to minimize void formation and to avoid any solder wicking into the
via.
Figure 10. Surface mount for power PQFN
Note For package dimensions, refer to the
33580 device datasheet.
with exposed pads
Analog Integrated Circuit Device Data
HIGH-SIDE SWITCH
24-PIN PQFN (12 x 12)
33580PNA
98ART10510D
PNA SUFFIX
Freescale Semiconductor
0.2
1.0
0.2
1.0