UPD720122GC-9EU-A Renesas Electronics America, UPD720122GC-9EU-A Datasheet - Page 81

• Manufacturer Part Number: UPD720122GC-9EU-A
• Manufacturer: Renesas Electronics America

Specifications of UPD720122GC-9EU-A

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Note
Note
4.
representative.
•
•
Infrared ray reflow
Partial heating method
Infrared ray reflow
Partial heating method
µ
µ
The
For soldering methods and conditions other than those recommended below, contact your NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
PD720122GC-9EU: 100-pin plastic TQFP (Fine pitch) (14 × 14)
PD720122GC-9EU-A: 100-pin plastic TQFP (Fine pitch) (14 × 14)
RECOMMENDED SOLDERING CONDITIONS
Soldering Method
Soldering Method
The Maximum number of days during which the product can be stored at a temperature of 25°C and a relative
humidity of 65% or less after dry-pack package is opened.
The Maximum number of days during which the product can be stored at a temperature of 25°C and a relative
humidity of 65% or less after dry-pack package is opened.
µ
PD720122 should be soldered and mounted under the following recommended conditions.
Table 4-1. Recommended Soldering Conditions of Surface-Mount Type (1/2)
Peak package’s surface temperature: 235° C, Reflow time: 30 seconds or less
(210 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each side of the device).
Peak package’s surface temperature: 260° C, Reflow time: 60 seconds or less
(220 °C or higher), Maximum allowable number of reflow processes: 3,
Exposure limit
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be baked
before unpacking.
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each side of the device).
Note
Note
: 3 days (10 hours pre-backing is required at 125C° afterwards).
: 7 days (10 hours pre-backing is required at 125C° afterwards),
Data Sheet S16685EJ3V0DS
Soldering Conditions
Soldering Conditions
µ
PD720122
IR35-103-3
IR60-107-3
Symbol
Symbol
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−
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