USB2412-DZK Standard Microsystems (SMSC), USB2412-DZK Datasheet - Page 20

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USB2412-DZK

Manufacturer Part Number
USB2412-DZK
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of USB2412-DZK

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Revision 1.0 (02-12-10)
5.2.1
5.2.2
Clock Input
Capacitance
Input Capacitance
Output Capacitance
Thermal Resistance
Junction-to-Top-of-Package
PARAMETER
Pin Capacitance
Package Thermal Specifications
Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal
vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the
ambient air.
PARAMETER
SYMBOL
C
C
Table 5.3 36-Pin QFN Package Thermal Parameters
C
XTAL
OUT
IN
MIN
Table 5.2 Pin Capacitance
(meters/sec)
VELOCITY
LIMITS
DATASHEET
TYP
0
1
0
1
20
MAX
6
6
6
SYMBOL
Θ
Ψ
UNIT
pF
pF
pF
JA
JT
All pins except USB pins and the pins
under the test tied to AC ground.
Capacitance T
fc = 1 MHz
VDD33 = 3.3 V
The maximum capacitance values
include the full length of the pin pad.
Please see the Y dimension in
Figure
7.2.
2-Port USB 2.0 Hi-Speed Hub Controller
VALUE
TEST CONDITION
40.3
35.2
0.5
0.6
A
= 25°C
SMSC USB2412
UNIT
°C/W
°C/W
Datasheet

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