5962-8866208UA QP SEMICONDUCTOR, 5962-8866208UA Datasheet - Page 13

• Manufacturer Part Number: 5962-8866208UA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-8866208UA

• Lead Free Status / RoHS Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
with each lot of microcircuits delivered to this drawing.
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
appendix A.
prior to quality conformance inspection. The following additional criteria shall apply:
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
a. Burn-in test, method 1015 of MIL-STD-883.
(1)
DEFENSE SUPPLY CENTER COLUMBUS
Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs,
biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883.
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
STANDARD
1/ * indicates PDA applies to subgroups 1 and 7.
2/ ** see 4.3.1c.
3/ See 4.3.1d.
Interim electrical parameters
Final electrical test parameters
(method 5004)
Group A test requirements
Groups C and D end-point electrical
parameters (method 5005)
(method 5004)
(method 5005)
MIL-STD-883 test requirements
TABLE II. Electrical test requirements.
SIZE
A
1,2,3,4**,7,8A,8B,
1*, 2, 3, 7*, 8A, 8B,
2, 3, 7, 8A, 8B
5005, table I)
(per method
Subgroups
9, 10,11
9, 10,11
1/ 2/ 3/
REVISION LEVEL
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D
SHEET
5962-88662
13