5962-8766101XA QP SEMICONDUCTOR, 5962-8766101XA Datasheet - Page 9

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5962-8766101XA

Manufacturer Part Number
5962-8766101XA
Description
Manufacturer
QP SEMICONDUCTOR
Datasheet

Specifications of 5962-8766101XA

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DSCC FORM 2234
APR 97
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
manufacturer prior to delivery.
specified in 4.4.
procedures and characteristics specified in 4.5.
to the specified program or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify
that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a failure, and shall be
removed from the lot.
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
with each lot of microcircuits delivered to this drawing.
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
be done initially and after any design or process change which may affect data retention. The methods and procedures may be
vendor specific, but will guarantee the number of years listed in section 1.3 herein over the full military temperature range. The
vendor's procedure shall be kept under document control and shall be made available upon request.
prior to quality conformance inspection. The following additional criteria shall apply:
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
3.9 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.10 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be specified by the
3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics
3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the
3.6.3 Verification of erasure or programmability of EPROMS. When specified, devices shall be verified as either programmed
a. Burn-in test, method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
(1)
(2) T
tests prior to burn-in are optional at the discretion of the manufacturer.
DEFENSE SUPPLY CENTER COLUMBUS
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-
STD-883.
A
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
= +125°C, minimum.
STANDARD
SIZE
A
REVISION LEVEL
F
SHEET
5962-87661
9

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