5962-8851805LA QP SEMICONDUCTOR, 5962-8851805LA Datasheet - Page 3

• Manufacturer Part Number: 5962-8851805LA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-8851805LA

• Lead Free Status / RoHS Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535
is required to identify when the QML flow option is used.
MIL-PRF-38535, appendix A and herein.
be as specified on figure 2.
manufacturer prior to test with a checkerboard pattern or equivalent (a minimum of 50 percent of the total number of bits
programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed.
drawing.
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
(Copies of these documents are available online at
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
3. REQUIREMENTS
3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall
3.2.2.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item
3.2.3 Logic diagram(s). The logic diagram shall be as specified on figure 3.
3.2.4 AC test loads and waveforms. The ac test loads and waveforms shall be as specified on figure 4.
3.2.5 Switching waveforms. The switching waveforms shall be as specified on figure 5.
3.2.6 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein.
2. APPLICABLE DOCUMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table. The truth table shall be as specified on figure 2.
DEPARTMENT OF DEFENSE SPECIFICATION
DEPARTMENT OF DEFENSE STANDARDS
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
MIL-STD-883
MIL-STD-1835 -
MIL-HDBK-103 -
MIL-HDBK-780 -
DEFENSE SUPPLY CENTER COLUMBUS
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
-
STANDARD
Interface Standard Electronic Component Case Outlines.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
List of Standard Microcircuit Drawings.
When required in groups A, B, C, or D (see 4.4), the devices shall be programmed by the
http://assist.daps.dla.mil/quicksearch/
SIZE
A
REVISION LEVEL
or
D
http://assist.daps.dla.mil
SHEET
5962-88518
or from the
3