AT24C16SX-09ET Atmel, AT24C16SX-09ET Datasheet - Page 13

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AT24C16SX-09ET

Manufacturer Part Number
AT24C16SX-09ET
Description
Manufacturer
Atmel
Datasheet

Specifications of AT24C16SX-09ET

Main Category
EEPROM Module
Sub-category
Serial-2Wire
Module Type
M2 - E Module
Device Core Size
8b
Organization
2Mx8
Total Density
16MBit
Access Time (max)
900ns
Maximum Clock Rate
400KHz
Operating Supply Voltage (typ)
5V
Operating Current
3mA
Number Of Elements
1
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Smart Card Modules
M2 - A Module
Module Size: M2
Dimension
Glob Top: Black, Square: 8.6 x 8.6 mm
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M2 - B Module - Ordering Code: 09BT
Module Size: M2
Dimension
Glob Top: Black, Square: 8.6 x 8.6 mm
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M4 - C Module - Ordering Code: 09CT
Module Size: M4
Dimension
Glob Top: Black, Square: 8.6 x 8.6 mm
Thickness: 0.58 mm
Pitch: 14.25 mm
M4 - D Module - Ordering Code: 09DT
Module Size: M4
Dimension
Glob Top: Black, Square: 8.6 x 8.6 mm
Thickness: 0.58 mm max.
Pitch: 14.25 mm
(1)
(1)
(1)
(1)
: 12.6 x 11.4 mm
: 12.6 x 11.4 mm
: 12.6 x 12.6 mm
: 12.6 x 12.6 mm
-
Ordering Code: 09AT
M2 - E Module - Ordering Code: 09ET
Module Size: M2
Dimension
Glob Top: Clear, Round: Ø 7.5 mm max.
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M2 - F Module - Ordering Code: 09FT
Module Size: M2
Dimension
Glob Top: Clear, Round: Ø 8.0 mm max.
Thickness: 0.58 mm max.
Pitch: 14.25 mm
M3 - G Module - Ordering Code: 09GT
Module Size: M3
Dimension
Glob Top: Clear, Round: Ø 6.5 mm max.
Thickness: 0.58 mm max.
Pitch: 9.5 mm
M3 - H Module - Ordering Code: 09HT
Module Size: M3
Dimension
Glob Top: Clear, Round: Ø 6.5 mm max.
Thickness: 0.58 mm max.
Pitch: 9.5 mm
Note:
1. The module dimensions listed refer to the dimensions of the
(1)
(1)
(1)
(1)
: 12.6 x 11.4 mm
: 12.6 x 11.4 mm
: 10.6 x 8.0 mm
: 10.6 x 8.0 mm
exposed metal contact area. The actual dimensions of the
module after excise or punching from the carrier tape are
generally 0.4 mm greater in both directions (i.e. a punched
M2 module will yield 13.0 x 11.8 mm).
13

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