KHX14400D3T1K3/6GX KINGSTON TECHNOLOGY, KHX14400D3T1K3/6GX Datasheet

KHX14400D3T1K3/6GX

Manufacturer Part Number

KHX14400D3T1K3/6GX

Description

Manufacturer

KINGSTON TECHNOLOGY

Datasheet

1.KHX14400D3T1K36GX.pdf (2 pages)

Specifications of KHX14400D3T1K3/6GX

Main Category

DRAM Module

Sub-category

DDR3 SDRAM

Module Type

240DIMM

Device Core Size

64b

Organization

256Mx64x3

Total Density

6GByte

Chip Density

1Gb

Maximum Clock Rate

1.333GHz

Operating Supply Voltage (typ)

1.5V

Number Of Elements

Operating Supply Voltage (max)

1.575V

Operating Supply Voltage (min)

1.425V

Operating Temp Range

0C to 85C

Operating Temperature Classification

Commercial

Pin Count

240

Mounting

Socket

Lead Free Status / RoHS Status

Supplier Unconfirmed

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Document No. 4805086-001.A00

DESCRIPTION:

Kingston's KHX14400D3T1K3/6GX is a triple-channel kit of three 256M x 64-bit 2GB (2048MB) DDR3-

1800 CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA

components per module. Each module kit supports Intel

has been tested to run at DDR3-1800MHz at a latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed

to JEDEC standard latency DDR3-1333Mhz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact

fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

FEATURES:

PERFORMANCE:

T E C H N O L O G Y

JEDEC standard 1.5V ± 0.075V Power Supply

VDDQ = 1.5V ± 0.075V

667MHz fCK for 1333Mb/sec/pin

8 independent internal bank

Programmable CAS Latency: 6,7,8,9

Posted CAS

Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

Programmable CAS Write Latency(CWL) = 9(DDR3-1333)

8-bit pre-fetch

Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or MRS]

Bi-directional Differential Data Strobe

Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)

On Die Termination using ODT pin

Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C

Asynchronous Reset

PCB : Height 2.401” (61.00mm) w/ heatsink, double sided component

CL(IDD)

Row Cycle Time (tRCmin)

Refresh to Active/Refresh Command Time (tRFCmin)

Row Active Time (tRASmin)

Power

UL Rating

Operating Temperature

Storage Temperature

6GB (2GB 256M x 64-Bit x 3 pcs.) PC3-14400

Triple-Channel CL9 240-Pin DIMM Kit

KHX14400D3T1K3/6GX

10/28/08

XMP (Extreme Memory Profiles). Each module kit

9 cycles

49.5ns (min.)

110ns

36ns (min.)

2.160 W (operating per module)

94 V - 0

-55

C to 85

C to +100

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KHX14400D3T1K3/6GX Summary of contents

Page 1

... PC3-14400 Triple-Channel CL9 240-Pin DIMM Kit DESCRIPTION: Kingston's KHX14400D3T1K3/6GX is a triple-channel kit of three 256M x 64-bit 2GB (2048MB) DDR3- 1800 CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel has been tested to run at DDR3-1800MHz at a latency timing of 9-9-9- ...

Page 2

... MODULE DIMENSIONS Units: millimeters w/ heatsink assembly Document No. 4805086-001.A00 ValueRAM Page 2 ...

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