MT18HTF25672PY-53EE1 Micron Technology Inc, MT18HTF25672PY-53EE1 Datasheet - Page 2

• Manufacturer Part Number: MT18HTF25672PY-53EE1
• Manufacturer: Micron Technology Inc

Specifications of MT18HTF25672PY-53EE1

• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240RDIMM
• Device Core Size: 72b
• Organization: 256Mx72
• Total Density: 2GByte
• Chip Density: 1Gb
• Access Time (max): 50ps
• Maximum Clock Rate: 533MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 2.25A
• Number Of Elements: 18
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Lead Free Status / RoHS Status: Compliant

Table 2:
Table 3:
Table 4:
Table 5:
PDF: 09005aef80e5e752/Source: 09005aef80e5e626
HTF18C64_128_256x72.fm - Rev. E 3/07 EN
Refresh count
Row address
Device bank address
Device page size per bank
Device configuration
Column address
Module rank address
MT18HTF12872(P)Y-80E__
MT18HTF12872(P)Y-800__
MT18HTF12872(P)Y-667__
MT18HTF12872(P)Y-53E__
MT18HTF12872(P)Y-40E__
MT18HTF25672(P)Y-80E__
MT18HTF25672(P)Y-800__
MT18HTF25672(P)Y-667__
MT18HTF25672(P)Y-53E__
MT18HTF25672(P)Y-40E__
MT18HTF6472Y-53E__
MT18HTF6472Y-40E__
Part Number
Part Number
Part Number
Addressing
Part Numbers and Timing Parameters – 512MB Modules
Base device: MT47H64M4,
Part Numbers and Timing Parameters – 1GB Modules
Base device: MT47H128M4,
Part Numbers and Timing Paramters – 2GB Modules
Base device: MT47H256M4,
Notes:
2
2
2
1. Data sheets for the base devices can be found on Micron’s Web site.
2. All part numbers end with a two-place code (not shown), designating component and PCB
revisions. Consult factory for current revision codes. Example: MT18HTF6472Y-667D2.
Module
Density
Module
Density
Module
Density
512MB
512MB
1GB
1GB
1GB
1GB
1GB
2GB
2GB
2GB
2GB
2GB
512MB, 1GB, 2GB (x72, ECC, SR) 240-Pin DDR2 SDRAM RDIMM
1
1
1
256Mb DDR2 SDRAM
512Mb DDR2 SDRAM
1Gb DDR2 SDRAM
Configuration
Configuration
Configuration
128 Meg x 72
128 Meg x 72
128 Meg x 72
128 Meg x 72
128 Meg x 72
64 Meg x 72
64 Meg x 72
256 Meg x 72
256 Meg x 72
256 Meg x 72
256 Meg x 72
256 Meg x 72
256Mb (64 Meg x 4)
2K (A0–A9, A11)
8K (A0–A12)
4 (BA0, BA1)
512MB
1 (S0#)
2
1KB
8K
Bandwidth
Bandwidth
Bandwith
Module
4.3 GB/s
3.2 GB/s
Module
6.4 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
3.2 GB/s
Module
6.4 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
3.2 GB/s
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb (128 Meg x 4)
2K (A0–A9, A11)
16K (A0–A13)
4 (BA0, BA1)
Memory Clock/
3.75ns/533 MT/s
Memory Clock/
5.0ns/400 MT/s
3.75ns/533 MT/s
Memory Clock/
1 (S0#)
3.75ns/533 MT/s
2.5ns/800 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
5.0ns/400 MT/s
2.5ns/800 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
5.0ns/400 MT/s
1GB
1KB
Data Rate
8K
Data Rate
Data Rate
©2003 Micron Technology, Inc. All rights reserved.
1Gb (256 Meg x 4)
8 (BA0, BA1, BA2)
2K (A0–A9, A11)
16K (A0–A13)
(CL-
(CL-
(CL-
1 (S0#)
Latency
Latency
2GB
Latency
1KB
t
8K
t
4-4-4
3-3-3
t
RCD-
5-5-5
6-6-6
5-5-5
4-4-4
3-3-3
RCD-
5-5-5
6-6-6
5-5-5
4-4-4
3-3-3
Features
RCD-
t
t
t
RP)
RP)
RP)