SLSDM256BU STEC, SLSDM256BU Datasheet

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SLSDM256BU

Manufacturer Part Number
SLSDM256BU
Description
Manufacturer
STEC
Type
MicroSD Cardr
Datasheet

Specifications of SLSDM256BU

Density
256MByte
Operating Supply Voltage (typ)
3.3V
Operating Temperature (min)
0C
Operating Temperature (max)
70C
Package Type
Not Required
Pin Count
8
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Programmable
Yes
Lead Free Status / RoHS Status
Compliant
Compliant to Specifications
Supports SD and SPI Modes
Variable Clock Rate:
Voltage Range
Low Power Consumption
Extended Data Write/Erase
Endurance
Data Retention: 10 years
Power-on damage free card
insertion and removal
Two Operating Temperature
Ranges available:
RoHS compliant lead-free
SD Memory Card Specification Part 1,
Physical Layer Specification V1.1
o
SD Memory Card Specification Part 2,
File System Specification V1.01
SD Memory Card Specification Part 3
Security Specification V1.01 (CPRM)
Low frequency: 0 to 25MHz
High frequency: 26Mhz to 50MHz
Basic communication : 2.0V to 3.6V
(CMD0, CMD15, CMD55, ACMD41)
Normal operating status: 2.7 to 3.6V
Optimized wear leveling algorithm
Hardware ECC to automatically detect
and correct errors
2,000,000 cycles (Preliminary)
Commercial: 0 to 70°C
Industrial: -40 to 85°C
microSD addendum version 1.1
SLISCDxxx(M/G)M1U(I)-y
Preliminary Datasheet
128MB to 1GB
Industrial Grade microSD Cards
61000-04349-101, September 2006
SLSDMxxxB(I)U
General Description
The Industrial Grades microSD is the smallest removable flash card on the
market, measuring only 11mm x 15mm x 1.00mm.
The microSD can be accessed trough 2 serial interfaces. The card can operate in
SD mode or in SPI mode. While the SD interface provides high performance 4 bit
data transfer, the SPI mode allows easy integration in any type of application at
lower performance.
STEC’s Industrial Grade microSD cards are specifically designed, manufactured
and tested to withstand extreme environmental conditions and to improve system
reliability and endurance.
At the heart of each card is an advanced microcontroller that performs elaborate
Flash management including 5-Bytes on-the-fly Error Detection and 4-Bytes
Correction (EDC/ECC), bad block management (BBM) and extensive wear
leveling.
STEC’s Industrial grade microSD utilizes only the highest reliability Single Level
Cell (SLC) Flash for its superior endurance.
This combination allows achieving 2,000,000 logical program/erase cycles.
The microSD has no moving parts inside. As such, it is made to withstand
extreme shock and vibration.
STEC manufacturing process and test methodology makes the card even more
robust. In fact, to assure that the cards shipped meets the rigorous threshold set
by the OEM customers, each card is extensively tested at STEC's manufacturing
facility to guarantee perfect functionality in any conditions. STEC provides
rigorous bill of material control as an additional guarantee for the customer,
ensuring long term product stability and availability.
Ordering Information
microSD Card
Legend:
SLSDM128B(I)U
SLSDM256B(I)U
SLSDM512B(I)U
SLSDM1GBB(I)U
(I) = Industrial temperature range (-40ºC to +85 ºC).
Part numbers without (I) = Commercial temperature range (0ºC to 70ºC).
Preliminary
Part Number
128 Mbytes
256 Mbytes
512 Mbytes
1 GBytes
www.stec-inc.com
Capacity
1

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SLSDM256BU Summary of contents

Page 1

... STEC manufacturing process and test methodology makes the card even more robust. In fact, to assure that the cards shipped meets the rigorous threshold set by the OEM customers, each card is extensively tested at STEC's manufacturing facility to guarantee perfect functionality in any conditions. STEC provides rigorous bill of material control as an additional guarantee for the customer, ensuring long term product stability and availability ...

Page 2

SLSDMxxxB(I)U Table of Contents 1.0 Product Specifications........................................................................................................3 1.1 Package Dimensions and Pin Locations...................................................................................... 3 1.2 Pin Assignment and Signal Description ....................................................................................... 5 1.3 Performance................................................................................................................................. 6 2.0 Environmental Specifications ............................................................................................6 2.1 Recommended Operating Conditions.......................................................................................... 6 2.2 Reliability ...................................................................................................................................... 7 2.3 Humidity ...

Page 3

SLSDMxxxB(I)U 1.0 Product Specifications 1.1 Package Dimensions and Pin Locations Refer to the Table 1, Figure 1, and Figure 2 for package dimensions and pin locations of the card. Units are in millimeters, and tolerances are ±0.15mm unless otherwise specified. ...

Page 4

SLSDMxxxB(I)U Figure 2: Mechanical Dimensions microSD Card (continued) Industrial Grade microSD Card Datasheet 61000-04581-104, July 2007 4 ...

Page 5

SLSDMxxxB(I)U 1.2 Pin Assignment and Signal Description Table 2: microSD Card Pin Assignment and Signal Description Pin Signal Name Bi-directionally I/O, 1 DAT2 I/O using Push-Pull Drivers Bi-directionally I/O, 2 CD, DAT3 I/O using Push-Pull Drivers 3 CMD I/O using ...

Page 6

SLSDMxxxB(I)U 1.3 Performance Measurements are in SD bus mode using HB Bench test. Table 3: microSD Card Read/Write Performance Parameter 128MB Sequential Read Up to 11.6 Sequential Write Up to 5.8 Random Read Up to 11.1 Random Write Up to ...

Page 7

SLSDMxxxB(I)U 2.2 Reliability Table 5: microSD Card Endurance & Data Retention Parameter Endurance Data retention Industrial Grade microSD Card Datasheet Value 2,000,000 Write/Erase Cycles 10 years 61000-04581-104, July 2007 7 ...

Page 8

SLSDMxxxB(I)U 2.3 Humidity & ESD Operating Humidity Storage Contact Pad, Human Body Model IEC61000-4-2: Charge C=100pF; Discharge R=1.5 K ohm ESD Non Contact Pad area, Human Body Model Coupling plane discharge Air discharge 3.0 Electrical Specifications 3.1 DC Characteristics Measurements ...

Page 9

SLSDMxxxB(I)U 3.2 Signal Loading The total capacitance C the CLK line of the SD memory card bus is the sum of the bus master L capacitance C , the bus capacitance C HOST this line ...

Page 10

SLSDMxxxB(I)U 3.3 AC Characteristics Table11: AC Characteristics Low Speed Mode Parameter Clock frequency in data transfer mode Clock frequency in card id mode Clock low time Clock high time Clock rise time Clock fall time Clock low time Clock high ...

Page 11

SLSDMxxxB(I)U Figure 4: AC Characteristics Low Speed Mode Industrial Grade microSD Card Datasheet 61000-04581-104, July 2007 11 ...

Page 12

SLSDMxxxB(I)U Table 12: AC Characteristics High Speed Mode Parameter Clock frequency in data transfer mode Clock low time Clock high time Clock rise time Clock fall time CMD, DAT input setup time CMD, DAT input hold time CMD, DAT output ...

Page 13

SLSDMxxxB(I)U 4.0 Host Access Specifications The following chapters summarize how the host accesses the card: • The block diagram in Chapter 4.1 shows how the SD and SPI buses interact with the registers via the controller. • Chapter 4.2 summarizes ...

Page 14

SLSDMxxxB(I)U 4.2 SD and SPI Bus Modes The card supports SD and the SPI Bus modes. Application can chose either one of the modes. Mode selection is transparent to the host. The card automatically detects the mode of the reset ...

Page 15

SLSDMxxxB(I)U Industrial Grade microSD Card Datasheet Figure 7: SD Bus Topology 61000-04581-104, July 2007 15 ...

Page 16

SLSDMxxxB(I)U 4.2.2 SPI Bus Mode Protocol The Serial Parallel Interface (SPI) Bus is a general purpose synchronous serial interface. The SPI mode consists of a secondary communication protocol. The interface is selected during the first reset command after power up ...

Page 17

SLSDMxxxB(I)U 4.2.3 Mode Selection The SD Memory Card wakes up in the SD mode. It will enter SPI mode if the CS signal is asserted (negative) during the reception of the reset command (CMD0) and the card is in idle_state. ...

Page 18

SLSDMxxxB(I)U 4.3 Card Registers The microSD Card has six registers. Refer to Table to Table for detail. Register Bit Description Name Width CID 128 Card Identification information OCR 32 Operation Conditions Registers CSD 128 Card specific information SD Memory Card’s ...

Page 19

SLSDMxxxB(I)U OCR bit VDD voltage position window 0-3 Reserved 4 1.6-1.7 5 1.7-1.8 6 1.8-1.9 7 1.9-2.0 8 2.0-2.1 9 2.1-2.2 10 2.2-2.3 11 2.3-2.4 12 2.4-2.5 13 2.5-2.6 14 2.6-2.7 Industrial Grade microSD Card Datasheet Table17: OCR Register OCR ...

Page 20

SLSDMxxxB(I)U Bit Register Name Width CSD_STRUCTURE 2 — 6 TAAC 8 NSAC 8 TRAN_SPEED 8 CCC 12 READ_BL_LEN 4 READ_BL_PARTIAL 1 WRITE_BLK_MISALIGN 1 READ_BLK_MISALIGN 1 DSR_IMP 1 — 2 C_SIZE 12 VDD_R_CURR_MIN 3 VDD_R_CURR_MAX 3 VDD_W_CURR_MIN 3 VDD_W_CURR_MAX 3 C_SIZE_MULT ...

Page 21

SLSDMxxxB(I)U Field SCR_STRUCTURE SD_SPEC DATA_STAT_AFTER_ER ASE SD_SECURITY SD_BUS_WIDTHS Reserved Reserved Industrial Grade microSD Card Datasheet Table 19: SCR Register Bit Width CID-slice 4 [63:60] 4 [59:56] 1 [55:55] 3 [54:52] 4 [51:48] 16 [47:32] 32 [31:0] 61000-04581-104, July 2007 Value ...

Page 22

... Contact STEC Inc. sales office to obtain the latest specification. All information in this document is provided “as is”. STEC Inc. grants no warranty of any kind with respect to this document, either expressed or implied, including, but not limited to any direct, indirect, special, consequential, or incidental damages ...

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