MT47H128M16HG-3 IT:A Micron Technology Inc, MT47H128M16HG-3 IT:A Datasheet - Page 23

MT47H128M16HG-3 IT:A

Manufacturer Part Number
MT47H128M16HG-3 IT:A
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H128M16HG-3 IT:A

Organization
128Mx16
Address Bus
17b
Access Time (max)
4.5ns
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
275mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
FBGA Package Capacitance
Table 4: Input Capacitance
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Parameter
Input capacitance: CK, CK#
Delta input capacitance: CK, CK#
Input capacitance: BA[2:0], A[14:0] (A[13:0] on
x16), CS#, RAS#, CAS#, WE#, CKE, ODT
Delta input capacitance: Address balls, bank
address balls, CS#, RAS#, CAS#, WE#, CKE, ODT
Input/output capacitance: DQ, DQS, DM, NF
Delta input/output capacitance: DQ, DQS, DM,
NF
Notes:
1. This parameter is sampled. V
2. The capacitance per ball group will not differ by more than this maximum amount for
3. ΔC are not pass/fail parameters; they are targets.
4. Reduce MAX limit by 0.25pF for -3/-3E speed devices.
MHz, T
with I/O balls, reflecting the fact that they are matched in loading.
any given device.
C
= 25°C, V
Symbol
OUT(DC)
C
C
C
C
C
DCK
C
DIO
CK
DI
IO
I
= V
23
DD
DDQ
= +1.8V ±0.1V, V
/2, V
Min
1.0
1.0
2.5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
OUT
(peak-to-peak) = 0.1V. DM input is grouped
2Gb: x4, x8, x16 DDR2 SDRAM
DDQ
Max
0.25
0.25
2.0
2.0
4.0
0.5
= +1.8V ±0.1V, V
© 2006 Micron Technology, Inc. All rights reserved.
Units
pF
pF
pF
pF
pF
pF
REF
= V
Packaging
SS
, f = 100
Notes
2, 3
2, 3
1, 4
2, 3
1
1

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