RD28F1604C3B90 Intel, RD28F1604C3B90 Datasheet - Page 70

• Manufacturer Part Number: RD28F1604C3B90
• Manufacturer: Intel

Specifications of RD28F1604C3B90

• Operating Supply Voltage (max): 3.3V
• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

C3 SCSP Flash Memory
26 Aug 2005
70
Package Height
16/02-Mb, 16/04-Mb, 32/08-Mb
Package Height
32/04-Mb
Ball Height
16/02-Mb, 16/04-Mb, 32/08-Mb
Ball Height
32/04-Mb
Package Body Thickness
16/02-Mb, 16/04-Mb, 32/08-Mb
Package Body Thickness
32/04-Mb
Ball (Lead) Width
16/02-Mb, 16/04-Mb, 32/08-Mb
Ball (Lead) Width
32/04-Mb
Package Body Length
16/02-Mb, 16/04-Mb
Package Body Length
32/04-Mb, 32/08-Mb
Package Body Width
16/02-Mb, 16/04-Mb, 32/04-Mb, 32/08-Mb
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along E
16/02-Mb, 16/04-Mb, 32/04-Mb, 32/08-Mb
Corner to Ball A1 Distance Along D
16/02-Mb, 16/04-Mb
Corner to Ball A1 Distance Along D
32/04-Mb, 32/08-Mb
Table 36. Packaging Specifications (0.13µm)
Intel
®
Advanced+ Boot Block Flash Memory (C3) SCSP Family
Order Number: 252636, Revision: 004
Sym
A1
A2
S1
S2
S2
A
D
E
N
Y
b
e
11.900
0.200
0.250
0.325
0.350
9.900
7.900
1.100
0.500
1.500
Min
Millimeters
10.000
12.000
0.860
0.960
0.375
8.000
0.800
1.200
0.600
1.600
Nom
0.40
66
10.100
12.100
1. 200
1. 400
0.425
0.450
8.100
0.100
1.300
0.700
1.700
Max
0.0079
0.0098
0.0128
0.0138
0.3898
0.4685
0.0433
0.0197
0.0591
0.3110
Min
Inches
0.0339
0.0378
0.0148
0.0157
0.3937
0.4724
0.3150
0.0315
0.0472
0.0236
0.0630
Nom
66
Datasheet
0.0472
0.0551
0.0167
0.0177
0.3976
0.4764
0.3189
0.0039
0.0512
0.0276
0.0669
Max