AM50DL128BG70I Spansion Inc., AM50DL128BG70I Datasheet - Page 63

• Manufacturer Part Number: AM50DL128BG70I
• Manufacturer: Spansion Inc.

Specifications of AM50DL128BG70I

• Operating Supply Voltage (max): 3.3V
• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

PHYSICAL DIMENSIONS
FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
62
A
CORNER
0.15
(2X)
PIN A1
A2
PACKAGE
SYMBOL
JEDEC
SD/SE
E1
eE
MD
ME
O
eD
A1
A2
D1
A
D
E
n
b
A1
C
73X
B2,B3,B4,B7,B8,B9,C2,C9,C10
H1,H10,J1,J10,K1,K2,K9,K10
D1,D10,E1,E10,F5,F6,G5,G6
M2,M3,M4,M5,M6,M7,M8,M9
MIN.
---
0.25
1.00
0.30
A2,A3,A4,A5,A6,A7,A8,A9
INDEX MARK
11.60 mm x 8.00 mm
0.15
0.08 M
L2,L3,L4,L7,L8,L9
6
10
PACKAGE
11.60 BSC.
FTA 073
b
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC
0.80 BSC
0.40 BSC
M
NOM.
0.35
N/A
12
10
73
---
---
---
C A B
C
MAX.
SIDE VIEW
1.40
---
1.11
TOP VIEW
0.40
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALL
P R E L I M I N A R Y
NOTE
Am50DL128BG
C
A
0.15
(2X)
E
B
C
0.20 C
0.08
eE
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
C
10
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
7
J
BOTTOM VIEW
H
G
D1
F
E
D C
B
A
January 8, 2003
SE
CORNER
PIN A1
7
3159\38.14b
E1