RD28F3208C3T70 Intel, RD28F3208C3T70 Datasheet - Page 56
RD28F3208C3T70
Manufacturer Part Number
RD28F3208C3T70
Description
Manufacturer
Intel
Datasheet
1.RD28F3208C3T70.pdf
(75 pages)
Specifications of RD28F3208C3T70
Operating Supply Voltage (max)
3.3V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
RD28F3208C3T70
Manufacturer:
FUJITSU
Quantity:
252
C3 SCSP Flash Memory
B.6
n
Table 27.
26 Aug 2005
56
Offset
2Ch
2Dh
2Ah
27h
28h
31h
Length
Device Geometry Definition
Device Geometry Definition
1
2
2
1
4
4
Intel
“n” such that device size = 2
Flash device interface: x8 async x16 async x8/x16 async
“n” such that maximum number of bytes in write buffer = 2
Number of erase block regions within device:
1. x = 0 means no erase blocking; the device erases in “bulk”
2. x specifies the number of device or partition regions with one or
more contiguous same-size erase blocks.
3. Symmetrically blocked partitions have one blocking region
4. Partition size = (total blocks) x (individual block size)
Erase Block Region 1 Information
bits 0–15 = y, y+1 = number of identical-size erase blocks
bits 16–31 = z, region erase block(s) size are z x 256 bytes
Erase Block Region 2 Information
bits 0–15 = y, y+1 = number of identical-size erase blocks
bits 16–31 = z, region erase block(s) size are z x 256 bytes
®
Advanced+ Boot Block Flash Memory (C3) SCSP Family
Order Number: 252636, Revision: 004
28:00,29:00 28:01,29:00 28:02,29:00
n
Description
in number of bytes
n
2A:
2B:
2C:
2D:
2E:
27:
28:
29:
2F:
30:
31:
32:
33:
34:
See Table Below
--01
--00
--00
--00
--02
Code
Datasheet
x16
0
2