S71PL064JA0BFW0P0 Spansion Inc., S71PL064JA0BFW0P0 Datasheet - Page 12

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S71PL064JA0BFW0P0

Manufacturer Part Number
S71PL064JA0BFW0P0
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of S71PL064JA0BFW0P0

Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S71PL064JA0BFW0P0
Manufacturer:
NXP
Quantity:
7
6.
6.1
12
Ordering Information
Valid Combinations
The order number is formed by a valid combinations of the following:
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S71PL
127
J
B0
BA
W
S71PL-J Based MCPs
9
Z
D a t a
0
Packing Type
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
See the Valid Combinations table.
Package Modifier
0 = 7 x 9 mm, 1.2 mm height, 56 balls (TLC056 or TSC065)
9 = 8 x 11.6 mm, 1.2 mm height, 64 balls (TLA064 or TSB064)
T = 8 x 11.6 mm, 1.4 mm height, 84 balls (FTA084)
Q = See the Valid Combinations table
Temperature Range
W = Wireless (-25
Package Type
BA = Fine-pitch BGA Lead (Pb)-free compliant package
BF = Fine-pitch BGA Lead (Pb)-free package
pSRAM Density
C0 = 64 Mb pSRAM
B0 = 32 Mb pSRAM
A0 = 16 Mb pSRAM
80 = 8 Mb pSRAM
40 = 4 Mb pSRAM
0A = 16 Mb pSRAM
08 = 8 Mb SRAM
04 = 4 Mb SRAM
Process Technology
J
Flash Density
254= 256 Mb
127= 128 Mb
064= 64 Mb
032= 32 Mb
Product Family
S71PL Multi-chip Product (MCP)3.0-volt Simultaneous Read/Write, Page
Mode Flash Memory and RAM
= 110 nm, Floating Gate Technology
S h e e t
°
C to +85
°
C)
S71PL-J_00_B6 February 17, 2010

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