MT29C4G48MAPLCJQ-6 IT TR Micron Technology Inc, MT29C4G48MAPLCJQ-6 IT TR Datasheet

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NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP™) MT29C Family Current production part numbers: See Table 1 on page 3 Features ® • Micron NAND Flash and Mobile LPDRAM components • RoHS-compliant, “green” package • Separate ...

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Part Numbering Information – 152-Ball PoP Micron NAND Flash and LPDRAM devices are available in different configurations and densities. Figure 2: 152-Ball Part Number Chart MT 29C 1G 24M Micron Technology Product Family 29C = NAND + LPDRAM MCP NAND ...

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... Table 1: Production Part Numbers Part Number MT29C4G48MAPLCCA-6 IT MT29C4G48MAPLCCA-75 IT MT29C4G48MAPLCJQ-6 IT MT29C4G48MAPLCJQ-75 IT MT29C1G12MADRACG-6 IT MT29C1G12MADRACG-75 IT MT29C2G24MAKLACG-6 IT MT29C2G24MAKLACG-75 IT MT29C1G12MAURACA-6 IT MT29C1G12MAURACA-75 IT MT29C1G12MAVRACA-6 IT MT29C1G12MAVRACA-75 IT Device Marking Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead, an abbreviated device mark consisting of a 5-digit alphanu- meric code is used ...

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General Description Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members ...

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Ball Assignments and Descriptions Figure 3: 152-Ball VFBGA Ball Assignments (NAND x8; LPDDR x16 LDM DQ5 DQ7 DDQ DQ1 DDQ SSQ ...

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Figure 4: 152-Ball VFBGA Ball Assignments (NAND x16; LPDDR x32 DM1 DQ13 DQ15 DDQ DQ6 DQ7 V DQ9 DDQ C V DQS0 SSQ DQ3 DQ5 D E ...

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Table 2: x8/x16 NAND Ball Descriptions Symbol Type ALE Input Address latch enable: When ALE is HIGH, addresses can be transferred to the on-chip address register. CE1#, CE0# Input Chip enable: Gates transfers between the host system and the NAND ...

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Table 3: x16/x32 LPDDR Ball Descriptions Symbol Type A[14:0] Input Address inputs: Specifies the row or column address. Also used to load the mode registers. The maximum LPDDR address is determined by density and configuration. Consult the LPDDR product data ...

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Electrical Specifications Table 5: Absolute Maximum Ratings Parameters/Conditions relative to V Voltage on any pin relative to V Storage temperature range Notes: 1. Supply voltage references either V Stresses greater than those listed under “Absolute Maximum ...

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Device Diagrams Figure 5: 152-Ball Functional Block Diagram (Single LPDDR) LOCK CKE0 RAS# CAS# Address, BA0, BA1 PDF: 09005aef8326e5ac / Source: 09005aef8326e59a 152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN 152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP CE0# ...

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Figure 6: 152-Ball Functional Block Diagram (Dual LPDDR) CS0#, CS1# CKE0, CKE1 Address, BA0, BA1 PDF: 09005aef8326e5ac / Source: 09005aef8326e59a 152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN 152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP CE0# CLE ALE ...

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Package Dimensions Figure 7: 152-Ball VFBGA (Package Code: CA) Seating plane A 0.12 A 152X Ø0.45 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0.35 SMD ball pads ...

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Figure 8: 152-Ball VFBGA (Package Code: CG) Seating plane A 0.1 A 152X Ø0.46 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0. ...

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Figure 9: 152-Ball TFBGA (Package Code: JQ) Seating plane A 0.12 A 152X Ø0.45 Solder ball material: SAC105. Dimensions apply to solder balls post- reflow on Ø0. ...

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Revision History Rev. E, Preliminary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...