S71PL254JC0BAWTZ0 Spansion Inc., S71PL254JC0BAWTZ0 Datasheet - Page 15
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S71PL254JC0BAWTZ0
Manufacturer Part Number
S71PL254JC0BAWTZ0
Description
Manufacturer
Spansion Inc.
Datasheet
1.S71PL254JC0BAWTZ0.pdf
(22 pages)
Specifications of S71PL254JC0BAWTZ0
Operating Supply Voltage (max)
3.1V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S71PL254JC0BAWTZ0
Manufacturer:
SPANSION
Quantity:
243
Part Number:
S71PL254JC0BAWTZ0
Manufacturer:
SPANSION
Quantity:
20 000
7.
February 17, 2010 S71PL-J_00_B6
Physical Dimensions
TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7 mm Package
PACKAGE
SYMBOL
A
SD / SE
JEDEC
D x E
MD
ME
A1
A2
D1
E1
eE
eD
CORNER
φb
D
A
E
n
0.15
(2X)
PIN A1
A2
A1
C
56X
0.20
0.81
0.35
MIN
A1,A8,D4,D5,E4,E5,H1,H8
---
9.00 mm x 7.00 mm
0.15 M
0.08
INDEX MARK
6
PACKAGE
9.00 BSC.
7.00 BSC.
5.60 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
b
TLC 056
M
10
NOM
0.40
N/A
---
---
---
56
8
8
C
C
A B
SIDE VIEW
D a t a
TOP VIEW
MAX
1.20
0.97
0.45
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S71PL-J Based MCPs
S h e e t
NOTE
C
A
0.15
(2X)
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
eD
e REPRESENTS THE SOLDER BALL GRID PITCH.
H
SD
BOTTOM VIEW
G
7
F
E
D1
D C
B
A
SE
CORNER
PIN A1
3348 \ 16-038.22a
7
E1
15