AD9858BSV Analog Devices Inc, AD9858BSV Datasheet - Page 29

• Manufacturer Part Number: AD9858BSV
• Manufacturer: Analog Devices Inc

Specifications of AD9858BSV

• Lead Free Status / RoHS Status: Not Compliant

OUTLINE DIMENSIONS
WARNING
The TQFP_EP (thermal slug) must be attached to the ground plane or some other large metal mass for thermal transfer. Failure to do so
may cause excessive die temperature rise and damage to the device.
ORDERING GUIDE
Model
AD9858BSV
AD9858BSVZ
AD9858/PCBZ
AD9858/FDPCB
AD9858/TLPCBZ
1
Z = RoHS Compliant Part.
1
1
1
SEATING
PLANE
0.75
0.60
0.45
0.20
0.09
MAX
1.20
3.5°
7°
0°
Temperature Range
–40°C to +85°C
–40°C to +85°C
25
1
100
26
0.50 BSC
16.00 BSC SQ
PIN 1
Figure 40. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(PINS DOWN)
TOP VIEW
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
14.00 BSC SQ
0.27
0.22
0.17
Dimensions shown in millimeters
0.15
0.05
Rev. C | Page 29 of 32
50
76
75
51
Package Description
100-Lead TQFP_EP
100-Lead TQFP_EP
Generic Evaluation Board
Fractional Divide Evaluation Board
Translation Loop Evaluation Board
(SV-100-1)
1.05
1.00
0.95
COPLANARITY
0.08
75
51
76
50
BOTTOM VIEW
CONDUCTIVE
HEAT SINK
(PINS UP)
NOM
6.50
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
100
26
1
25
Package Option
SV-100-1
SV-100-1
AD9858