DS90LT012ATMFX National Semiconductor, DS90LT012ATMFX Datasheet - Page 5
![no-image](/images/manufacturer_photos/0/4/469/national_semiconductor_sml.jpg)
DS90LT012ATMFX
Manufacturer Part Number
DS90LT012ATMFX
Description
Manufacturer
National Semiconductor
Datasheet
1.DS90LT012ATMFX.pdf
(8 pages)
Specifications of DS90LT012ATMFX
Number Of Elements
1
Input Type
CMOS
Operating Supply Voltage (typ)
3.3V
Diff. Input Low Threshold Volt
-100mV
Propagation Delay Time
3.5ns
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
5
Package Type
SOT-23
Number Of Receivers
1
Number Of Drivers
1
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DS90LT012ATMFX
Manufacturer:
NS/国半
Quantity:
20 000
the decoupling capacitors to the power planes. A 10μF (35V)
or greater solid tantalum capacitor should be connected at the
power entry point on the printed circuit board between the
supply and ground.
PC BOARD CONSIDERATIONS
Use at least 4 PCB board layers (top to bottom): LVDS sig-
nals, ground, power, TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL
signals may couple onto the LVDS lines. It is best to put TTL
and LVDS signals on different layers which are isolated by a
power/ground plane(s).
Keep drivers and receivers as close to the (LVDS port side)
connectors as possible.
For PC board considerations for the LLP package, please re-
fer to application note AN-1187 “Leadless Leadframe Pack-
age.” It is important to note that to optimize signal integrity
(minimize jitter and noise coupling), the LLP thermal land pad,
which is a metal (normally copper) rectangular region located
under the package, should be attached to ground and match
the dimensions of the exposed pad on the PCB (1:1 ratio).
DIFFERENTIAL TRACES
Use controlled impedance traces which match the differential
impedance of your transmission medium (ie. cable) and ter-
mination resistor. Run the differential pair trace lines as close
together as possible as soon as they leave the IC (stubs
should be < 10mm long). This will help eliminate reflections
and ensure noise is coupled as common-mode. In fact, we
have seen that differential signals which are 1mm apart radi-
ate far less noise than traces 3mm apart since magnetic field
cancellation is much better with the closer traces. In addition,
noise induced on the differential lines is much more likely to
appear as common-mode which is rejected by the receiver.
Match electrical lengths between traces to reduce skew.
Skew between the signals of a pair means a phase difference
between signals which destroys the magnetic field cancella-
tion benefits of differential signals and EMI will result! (Note
that the velocity of propagation, v = c/E
of light) = 0.2997mm/ps or 0.0118 in/ps). Do not rely solely on
the autoroute function for differential traces. Carefully review
dimensions to match differential impedance and provide iso-
lation for the differential lines. Minimize the number of vias
and other discontinuities on the line.
Avoid 90° turns (these cause impedance discontinuities). Use
arcs or 45° bevels.
Within a pair of traces, the distance between the two traces
should be minimized to maintain common-mode rejection of
FAIL-SAFE FEATURE
The LVDS receiver is a high gain, high speed device that am-
plifies a small differential signal (20mV) to CMOS logic levels.
Due to the high gain and tight threshold of the receiver, care
FIGURE 5. VTC of the DS90LV012A and DS90LT012A LVDS Receivers
r
where c (the speed
5
the receivers. On the printed circuit board, this distance
should remain constant to avoid discontinuities in differential
impedance. Minor violations at connection points are allow-
able.
TERMINATION
DS90LV012A:
Use a termination resistor which best matches the differential
impedance or your transmission line. The resistor should be
between 90Ω and 130Ω. Remember that the current mode
outputs need the termination resistor to generate the differ-
ential voltage. LVDS will not work without resistor termination.
Typically, connecting a single resistor across the pair at the
receiver end will suffice.
Surface mount 1% - 2% resistors are the best. PCB stubs,
component lead, and the distance from the termination to the
receiver inputs should be minimized. The distance between
the termination resistor and the receiver should be < 10mm
(12mm MAX).
DS90LT012A:
The DS90LT012A integrates the terminating resistor for
point-to-point applications. The resistor value will be between
90Ω and 133Ω.
THRESHOLD
The LVDS Standard (ANSI/TIA/EIA-644-A) specifies a maxi-
mum threshold of ±100mV for the LVDS receiver. The
DS90LV012A and DS90LT012A support an enhanced
threshold region of −100mV to 0V. This is useful for fail-safe
biasing. The threshold region is shown in the Voltage Transfer
Curve (VTC) in Figure 5. The typical DS90LV012A or
DS90LT012A LVDS receiver switches at about −30mV. Note
that with V
external fail-safe bias of +25mV applied, the typical differen-
tial noise margin is now the difference from the switch point
to the bias point. In the example below, this would be 55mV
of Differential Noise Margin (+25mV − (−30mV)). With the en-
hanced threshold region of −100mV to 0V, this small external
fail-safe biasing of +25mV (with respect to 0V) gives a DNM
of a comfortable 55mV. With the standard threshold region of
±100mV, the external fail-safe biasing would need to be
+25mV with respect to +100mV or +125mV, giving a DNM of
155mV which is stronger fail-safe biasing than is necessary
for the DS90LV012A or DS90LT012A. If more DNM is re-
quired, then a stronger fail-safe bias point can be set by
changing resistor values.
should be taken to prevent noise from appearing as a valid
signal.
The receiver's internal fail-safe circuitry is designed to source/
sink a small amount of current, providing fail-safe protection
ID
= 0V, the output will be in a HIGH state. With an
20015029
www.national.com