HIP0081AS1 Intersil, HIP0081AS1 Datasheet - Page 4

no-image

HIP0081AS1

Manufacturer Part Number
HIP0081AS1
Description
Manufacturer
Intersil
Datasheet

Specifications of HIP0081AS1

Lead Free Status / RoHS Status
Supplier Unconfirmed

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HIP0081AS1
Manufacturer:
INTERSIL
Quantity:
5 510
Part Number:
HIP0081AS1
Manufacturer:
HIT
Quantity:
5 510
Absolute Maximum Ratings
Supply Voltage (Logic and Control), V CC . . . . . . . . . . . . -16 to 45V
Power MOSFET Drain Voltage, V O (Note 1) . . . . . . -0.5 to V
Maximum Output Clamp Energy, E
Maximum Output Clamp Energy, E
Input Voltage (Logic and Driver Inputs), V IN . . . . . . . . . . . -0.5 to 7V
Output Voltage, DATAOUT . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 7V
HIP0080 Output Current
HIP0081 Output Current
Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . -40
Junction Temperature Range . . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
POWER OUTPUTS
Output ON Resistance
(HIP0081)
Output ON Resistance
(HIP0080)
HIP0081 Output Off Current
HIP0081 Output Leakage
Current
1. The MOSFET Output Drain is internally Clamped with a Drain-to-Gate zener diode that turns-on the MOSFET to hold the Drain at the V CLAMP
2. Each Output has Over-Current Shutdown protection in the positive current direction. The maximum peak current rating is determined by the
3. Effective Heat Sinking for the HIP0080 PLCC package requires a PC Board solder mount or equivalent. The HIP0080
4. Refer to Figures 4 and 5 Single Pulse Output Clamp Energy vs. Time Capability of the HIP0080 and HIP0081. The safe margin for single pulse
Each Output, I OUT(PEAK) , (Note 2) . . . . . . -1.5A to I
Each Output, I OUT(DC) . . . . . . . . . . . . . . . . . . . . . . . . +1.3A
Total of 4 Outputs ON, Unequal I OUT . . . . . . . . . . . . . . . . +3A
Total of 4 Outputs ON, Unequal I OUT . . . . . +4A/500ms (Max)
Each Output, I OUT(PEAK) , (Note 2) . . . . . . . . . -2 to I
Each Output, I OUT(DC) . . . . . . . . . . . . . . . . . . . . . . . . +2.2A
Total of 4 Outputs, ON, Unequal I OUT . . . . . . . . . . . . . . . +6A
Total of 4 Outputs ON, Unequal I OUT . . . . . +8A/500ms (Max)
voltage. Refer to the Electrical Characteristic Tables for the V CLAMP voltage limits.
minimum Over-Current Shutdown as detailed in the Electrical Specification Table. In the event of an Over-Current Shutdown the input drive is
latched OFF. The output short must be removed and the input toggled OFF and ON to restore the output drive.
resistance is given for a PC Board with 2 sq. in. of 1 oz. surface mount ground copper extending away from the package. For additional Power
Dissipation Derating information, see Figure 8 curves.
energy operation is below the dotted line shown in Figures 4 and 5.
PARAMETER
SYMBOL
I
OFFLK
4
I
r
r
OFF
OK
OK
ON
ON
V
CC
(HIP0080) . . . . . . . . .
(HIP0081) . . . . . . . . .
= 5.5V to 25V 5%, T
V
I
V
I
V
I
V
I
Inputs Low, Each V OUT = 60V
T
Inputs Low, Each V OUT = 60V, T
Inputs Low, Each V OUT = 60V, V CC = 0V
OUT1
OUT1
OUT1
OUT1
A
CC
CC
CC
CC
= 25
= 10 to 25V, All Outputs ON
= 5.5 to 10V, All Outputs ON
= 10 to 25V, All Outputs ON
= 5.5 to 10V, All Outputs ON
= I
= I
= I
= I
o
OUT2
OUT2
C to 125
OUT2
OUT2
TEST CONDITIONS
o
o
C to 125
C to 150
= I
= I
= I
= I
HIP0080, HIP0081
OUT(SC)
OUT(SC)
OUT3
OUT3
o
OUT3
OUT3
CLAMP
Note 4
Note 4
A
C
= -40
o
o
C
C
= I
= I
= I
= I
OUT4
OUT4
o
OUT4
OUT4
C to 125
= 0.5A
= 0.4A
= 1A
= 0.7A
A
Thermal Information
Thermal Resistance (Typical, Note 3)
HIP0080 Power Dissipation with a 2 sq. in. PC Board Heat Sink:
HIP0081 Power Dissipation with Infinite Heat Sink:
Maximum Storage Temperature Range, T STG . . . . -55
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . 300
Die Characteristics
HIP0080 Back Side Potential . . . . . . . . . . . . . . Frame, GND Leads
HIP0081 Back Side Potential . . . . . . . . . Heat Sink Tab, GND Lead
= -40
o
C, Unless Otherwise Specified
HIP0080 . . . . . . . . . . . . . . . . . . . . . . . .
HIP0080 (on 2 sq. in. PC Board) . . . . .
HIP0081 . . . . . . . . . . . . . . . . . . . . . . . .
At 85
Above 85
At 125
Above 125
o
C
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.95W
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.33W
MIN
o
-
-
-
-
-
-
-
C:. . . . . . . . . . . . . . . . . . . Derate Linearly at 30mW/
o
C . . . . . . . . . . . . . . . . . Derate Linearly at 333 mW/
HIP0080
TYP
-
-
-
-
-
-
-
MAX
1.0
2.0
-
-
-
-
-
MIN
-
-
-
-
-
-
-
HIP0081
JA
TYP
0.75
0.75
JA
1.0
junction-to-air thermal
-
-
-
-
(
43
33
45
o
C/W)
MAX
0.5
1.0
1.0
1.5
10
-
-
o
C to 150
JC
UNITS
N/A
N/A
(
o
3
mA
mA
C/W)
A
o
o
o
o
C
C
C
C

Related parts for HIP0081AS1