ISP1506ABS STEricsson, ISP1506ABS Datasheet - Page 73

• Manufacturer Part Number: ISP1506ABS
• Manufacturer: STEricsson

Specifications of ISP1506ABS

• Lead Free Status / RoHS Status: Supplier Unconfirmed

NXP Semiconductors
19. Abbreviations
ISP1506A_ISP1506B_2
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 60.
Acronym
ASIC
ATX
CD-RW
EOP
ESD
ESR
FS
HBM
HNP
HS
ID
IEC
LS
NRZI
OTG
PCB
PHY
PID
PLL
Fig 36. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Application-Specific Integrated Circuit
Analog USB Transceiver
Compact Disc-ReWritable
End-Of-Packet
ElectroStatic Discharge
Effective Series Resistance
Full-Speed
Human Body Model
Host Negotiation Protocol
High-Speed
Identification
International Electrotechnical Commission
Low-Speed
Non-Return-to-Zero Inverted
On-The-Go
Printed-Circuit Board
Physical Layer
Packet Identifier
Phase-Locked Loop
Rev. 02 — 28 August 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
ISP1506A; ISP1506B
ULPI HS USB OTG transceiver
temperature
peak
© NXP B.V. 2008. All rights reserved.
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