ISP1105W,115 STEricsson, ISP1105W,115 Datasheet - Page 24

• Manufacturer Part Number: ISP1105W,115
• Manufacturer: STEricsson

Specifications of ISP1105W,115

• Number Of Transceivers: 1
• Esd Protection: YeskV
• Power Supply Requirement: Triple
• Operating Supply Voltage (typ): Not RequiredV
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (max): Not RequiredV
• Operating Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): 1.8/2.5/3.3/5V
• Dual Supply Voltage (max): 3.6/5.5V
• Dual Supply Voltage (min): 1.65/3/4V
• Pin Count: 16
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Lead Free Status / RoHS Status: Supplier Unconfirmed

ISP1105_1106_9
Product data sheet
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 18.
Table 19.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
≥ 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
19
18.
Rev. 09 — 19 January 2009
Package reflow temperature (°C)
Volume (mm
< 350
235
220
Package reflow temperature (°C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
18) than a SnPb process, thus
≥ 350
220
220
Advanced USB transceivers
ISP1105/1106
© ST-NXP Wireless 2009. All rights reserved.
> 2000
260
245
245
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