TRCV0110G LSI, TRCV0110G Datasheet - Page 22

• Manufacturer Part Number: TRCV0110G
• Manufacturer: LSI

Specifications of TRCV0110G

• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 3.13V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

TRCV0110G 10 Gbits/s Limiting Amplifier
Data Sheet
Clock Recovery, 1:16 Data Demultiplexer
June 7, 2002
Packaging Characteristics
CBGA (Ceramic Ball Grid Array) Package Information
The substrate is 99.6% alumina (Al2O3) material. The standoff height is accomplished by using 0.013 in. diameter
copper silver (CuAg) balls, which are attached using a eutectic braze to the thin film metal pads on the substrate.
After brazing, the balls have a diameter at the braze fillet of 0.016 in. (at the interface of the ball and substrate), but
still maintain their height of 0.013 in. for standoff height.
CBGA PWB Design Information
The layout of the bare PWB should use a 0.016 in. diameter pad. The pad should be defined by the copper and not
by solder mask. (The only copper leading away from the pad should be the trace connected to it; the pad should
not be part of a large ground plane unless only connected to the ground plane by a single trace.) Avoid placement
of vias in the pads used for ball attachment on the PWB. Vias should be connected by a trace (or tear dropped)
with a sufficient dam of solder mask to prevent solder from wicking into the via and away from the ball/PWB solder
joint.
The stencil opening should be designed at 0.016 in. as well, to match up with the CBGA pads.
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Agere Systems Inc.