USB2240I-AEZG-XX Standard Microsystems (SMSC), USB2240I-AEZG-XX Datasheet - Page 45

• Manufacturer Part Number: USB2240I-AEZG-XX
• Manufacturer: Standard Microsystems (SMSC)

Specifications of USB2240I-AEZG-XX

• Lead Free Status / RoHS Status: Compliant

Ultra Fast USB 2.0 Multi-Format, SD/MMC, and MS Flash Media Controllers
Datasheet
SMSC USB224x
9.5
Thermal Resistance
Junction-to-Top-of-Package
Note 9.10 Thermal parameters are measured or estimated for devices with the exposed pad soldered
Package Thermal Specifications
PARAMETER
to thermal vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured
from the die to the ambient air.
Table 9.2 36-Pin QFN Package Thermal Parameters
(meters/sec)
VELOCITY
0
1
2
0
1
2
DATASHEET
45
SYMBOL
Θ
Ψ
JA
JT
VALUE
33.2
2.6
2.6
2.6
29
26
Revision 2.0 (10-14-09)
UNIT
°C/W
°C/W