STM8L152R8T6 STMicroelectronics, STM8L152R8T6 Datasheet - Page 123

• Manufacturer Part Number: STM8L152R8T6
• Description: 8 BITS MICROCONTR
• Manufacturer: STMicroelectronics
• Series: STM8L EnergyLiter

Specifications of STM8L152R8T6

• Core Processor: STM8
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, IR, LCD, POR, PWM, WDT
• Number Of I /o: 54
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 28x12b, D/A 2x12
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

STM8L15xx8, STM8L15xR6
Table 65.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Figure 51. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package
Symbol
back-side pad to PCB ground.
UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm
pitch package mechanical data
outline
0.550
0.020
0.530
0.150
0.230
7.000
4.700
7.000
4.700
0.500
0.400
Typ
(1)(2)(3)
millimeters
0.500
0.500
0.180
6.850
2.250
6.850
2.250
0.450
0.300
0.140
0.080
Min
0
Doc ID 17943 Rev 4
0.600
0.050
0.550
0.160
0.300
7.150
5.250
7.150
5.250
0.550
0.500
Max
Figure 52. Recommended footprint
0.02170
0.0008
0.0209
0.0059
0.0091
0.2756
0.1850
0.2756
0.1850
0.0197
0.0157
7.30
Typ
0.30
0.55
0.20
12
1
48
13
(dimensions in mm)
inches
6.20
0.01970
0.0197
0.0055
0.0071
0.2697
0.0886
0.2697
0.0886
0.0177
0.0118
0.0031
Package characteristics
Min
0
7.30
5.60
5.80
6.20
(1)
5.60
0.50
37
24
0.0236
0.0020
0.0217
0.0063
0.0118
0.2815
0.2067
0.2815
0.2067
0.0217
0.0197
36
25
Max
(1)
0.75
123/126
5.80
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