SST38VF6402-90-5I-B3KE Microchip Technology, SST38VF6402-90-5I-B3KE Datasheet - Page 2

• Manufacturer Part Number: SST38VF6402-90-5I-B3KE
• Description: 2.7V To 3.6V 64Mbit Pm Parallel Advanced MPF+ 48 TFBGA 6x8x1.2 Mm TRAY
• Manufacturer: Microchip Technology

Specifications of SST38VF6402-90-5I-B3KE

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 64M (4M x 16)
• Speed: 90ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
although some dimensions may be more stringent.
0.70
0.50
Pin # 1 Identifier
TSOP-48 (EK) Package Diagram
SST38VF6401
SST38VF6402
SST38VF6403
SST38VF6404
38 Series: Advanced MPF+
Silicon Storage Technology, Inc., a wholly owned subsidiary of Microchip Technology, Inc.
Device
Advanced MPF+ Benefits
Page Read – Short boot-up times and fast execute-in-place
Write-Buffer Programming – Fast field updates and in-system programming
Bypass Mode – Reduces overhead on program and erase commands
Protection/Security – Prevents unauthorized and accidental changes to data
SuperFlash Technology – High performance, superior reliability and low power
18.50
18.30
20.20
19.80
Memory Address
Product
Density
64 Mbit
64 Mbit
64 Mbit
64 Mbit
RESET#
WE#
WP#
CE#
OE#
Voltage
2.7-3.6V
2.7-3.6V
2.7-3.6V
2.7-3.6V
Address Buffer & Latches
12.20
11.80
1.20
max.
Speed (ns)
Access
90
90
90
90
Functional Block Diagram
DETAIL
Control Logic
1mm
1.05
0.95
Temperature
48-tsop-EK-8
0.15
0.05
0.70
0.50
BSC
0.50
0.27
0.17
C/I
C/I
C/I
C/I
X-Decoder
0°- 5°
Bottom boot-block uniform (32 KWord)
Top boot-block uniform (32 KWord)
Bottom boot-block non-uniform (8 KWord) TSOP-48, TFBGA-48
Top boot-block non-uniform (8 KWord)
Note:
6
5
4
3
2
1
RY/BY#
Hardware Block Protection
A1 CORNER
1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
For more information please contact your local SST Sales Representative.
See the “Sales” page of www.SST.com for complete listings.
© 2010 Silicon Storage Technology, Inc. The SST logo, SST and SuperFlash
are registered trademarks and MPF is a trademark of
Silicon Storage Technology, Inc.
A B C D E F G H
SEATING PLANE
SIDE VIEW
TOP VIEW
8.00 ± 0.20
TFBGA-48 (B3K) Package Diagram
I/O Buffers and Data Latches
0.35 ± 0.05
DQ
SuperFlash
Y-Decoder
6.00 ± 0.20
1.10 ± 0.10
Memory
Silicon Storage Technology, Inc.
1020 Kifer Road
Sunnyvale, CA 94086-5308
Tel: [phone]
Fax: [phone]
www.SST.com
15
- DQ
0.12
0
4.00
0.80
TSOP-48, TFBGA-48
TSOP-48, TFBGA-48
TSOP-48, TFBGA-48
Packages
H G F E D C B A
BOTTOM VIEW
5.60
0.80
A1 CORNER
6
5
4
3
2
1
48-tfbga-B3K-6x8-450mic-4
1mm
0.45 ± 0.05
(48X)