S29AL008J70BFI013 Spansion Inc., S29AL008J70BFI013 Datasheet - Page 3

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S29AL008J70BFI013

Manufacturer Part Number
S29AL008J70BFI013
Description
IC 8M FLASH MEMORY
Manufacturer
Spansion Inc.
Datasheet

Specifications of S29AL008J70BFI013

Cell Type
NOR
Density
8Mb
Access Time (max)
70ns
Interface Type
Parallel
Boot Type
Top
Address Bus
20/19Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
FBGA
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
1M/512K
Supply Current
12mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Compliant
Distinctive Characteristics
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient pro-
duction volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid com-
binations offered may occur.
Architectural Advantages
S29AL008J
8 Megabit (1 M x 8-Bit/512 K x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
Data Sheet
Single Power Supply Operation
– Full voltage range: 2.7 to 3.6 volt read and write operations for
Manufactured on 110 nm Process Technology
– Fully compatible with 200 nm S29AL008D
Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure identification
– May be programmed and locked at the factory or by the customer
Flexible Sector Architecture
– One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and fifteen 64 Kbyte
– One 8 Kword, two 4 Kword, one 16 Kword, and fifteen 32 Kword
Sector Group Protection Features
– A hardware method of locking a sector to prevent any program or
– Sectors can be locked in-system or via programming equipment
– Temporary Sector Unprotect feature allows code changes in
Unlock Bypass Program Command
– Reduces overall programming time when issuing multiple program
Top or Bottom Boot Block Configurations Available
Compatibility with JEDEC standards
– Pinout and software compatible with single-power supply Flash
– Superior inadvertent write protection
battery-powered applications
through an 8-word/16-byte random Electronic Serial Number
accessible through a command sequence
sectors (byte mode)
sectors (word mode)
erase operations within that sector
previously locked sectors
command sequences
Publication Number S29AL008J_00
Revision 09
Performance Characteristics
Package Options
Software Features
Hardware Features
High Performance
– Access times as fast as 55 ns
– Extended temperature range (–40°C to +125°C)
Ultra Low Power Consumption (typical values at 5 MHz)
– 0.2 µA Automatic Sleep mode current
– 0.2 µA standby mode current
– 7 mA read current
– 20 mA program/erase current
Cycling Endurance: 1,000,000 cycles per sector typical
Data Retention: 20 years typical
48-ball Fine-pitch BGA
48-pin TSOP
56-pin SSOP
CFI (Common Flash Interface) Compliant
– Provides device-specific information to the system, allowing host
Erase Suspend/Erase Resume
– Suspends an erase operation to read data from, or program data to,
Data# Polling and Toggle Bits
– Provides a software method of detecting program or erase operation
Ready/Busy# Pin (RY/BY#)
– Provides a hardware method of detecting program or erase cycle
Hardware Reset Pin (RESET#)
– Hardware method to reset the device to reading array data
WP# input pin
– For boot sector devices: at V
software to easily reconfigure for different Flash devices
a sector that is not being erased, then resumes the erase operation
completion
completion
depending on boot configuration (top boot or bottom boot)
Issue Date February 23, 2010
IL
, protects first or last 16 Kbyte sector

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