PIC24HJ128GP204T-I/PT Microchip Technology, PIC24HJ128GP204T-I/PT Datasheet - Page 346
![16-bit MCU, 128KB Flash,DMA,40 MIPS,nanoWatt 44 TQFP 10x10x1mm T/R](/photos/6/82/68251/c04-076_pt_sml.jpg)
PIC24HJ128GP204T-I/PT
Manufacturer Part Number
PIC24HJ128GP204T-I/PT
Description
16-bit MCU, 128KB Flash,DMA,40 MIPS,nanoWatt 44 TQFP 10x10x1mm T/R
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP302-ISO.pdf
(368 pages)
3.PIC24HJ32GP302-ISO.pdf
(8 pages)
4.PIC24HJ32GP302-ISO.pdf
(12 pages)
Specifications of PIC24HJ128GP204T-I/PT
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
128KB (43K x 24)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC24HJ128GP204T-I/PTTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ128GP204T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP302-ISO PDF datasheet #2
- PIC24HJ32GP302-ISO PDF datasheet #3
- PIC24HJ32GP302-ISO PDF datasheet #4
- Current page: 346 of 368
- Download datasheet (5Mb)
PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
DS70293E-page 346
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
PAD
E2
1
2
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
MILLIMETERS
0.65 BSC
8.00 BSC
8.00 BSC
0.20 REF
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
–
D2
© 2011 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
K
e
b
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