PIC18F2221-E/SP Microchip Technology, PIC18F2221-E/SP Datasheet - Page 342

• Manufacturer Part Number: PIC18F2221-E/SP
• Description: 4KB, Flash, 512bytes-RAM, 25I/O, 8-bit Family,nanoWatt 28 SPDIP .300in TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2221-E/SP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 4KB (2K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC18F2221/2321/4221/4321 FAMILY
27.2
DS39689F-page 342
PIC18LF2221/2321/4221/4321
PIC18F2221/2321/4221/4321
Legend:
Note 1:
Param
No.
(Industrial)
(Industrial, Extended)
2:
3:
4:
5:
DC Characteristics:
Supply Current (I
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
Extended Devices Only
Extended Devices Only
Device
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
All Devices
All Devices
All Devices
All Devices
DD
DD
)
(2)
; WDT enabled/disabled as specified.
DD
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Power-Down and Supply Current
PIC18F2221/2321/4221/4321 (Industrial)
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)
Typ
measurements in active operation mode are:
10
17
18
15
15
18
18
7
6
6
6
9
9
9
Max
10
10
10
10
12
12
12
12
19
19
19
23
23
23
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
+125°C
+125°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
-40°C
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
A
A
A
≤ +85°C for industrial
≤ +85°C for industrial
≤ +125°C for extended
V
V
V
V
DD
DD
DD
DD
= 4.2V
= 5.0V
= 4.2V
= 5.0V
Conditions
© 2009 Microchip Technology Inc.
DD
or V
SS
(PRI_RUN HS+PLL)
(PRI_RUN HS+PLL)
(PRI_RUN HS+PLL)
(PRI_RUN HS+PLL)
DD
F
F
, and all features that
16 MHz internal
16 MHz internal
40 MHz internal
40 MHz internal
F
F
OSC
OSC
or V
OSC
OSC
SS
= 10 MHz,
= 10 MHz,
= 4 MHz,
= 4 MHz,
;