PIC16LF1903T-I/MV Microchip Technology, PIC16LF1903T-I/MV Datasheet - Page 197

7KB Flash, 256B RAM, LCD, 11x10b ADC, NanoWatt XLP 28 UQFN 4x4x0.5mm T/R

PIC16LF1903T-I/MV

Manufacturer Part Number
PIC16LF1903T-I/MV
Description
7KB Flash, 256B RAM, LCD, 11x10b ADC, NanoWatt XLP 28 UQFN 4x4x0.5mm T/R
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet

Specifications of PIC16LF1903T-I/MV

Processor Series
PIC16LF190x
Core
PIC
Data Bus Width
8 bit
Program Memory Type
Flash
Program Memory Size
4 KB
Data Ram Size
256 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
25
Number Of Timers
2
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
QFN-28
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
-
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
-
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Lead Free Status / Rohs Status
 Details
21.0
Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current out of V
Maximum current into V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Note 1:
 2011 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
DD
with respect to V
K
(V
PIN
(1)
DD
DD
< 0 or V
............................................................................................................................... 800 mW
SS
SS
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
PIN
SS
> V
(†)
................................................................................................... -0.3V to +4.0V
DD
A
A
SS
)20 mA
A
A
 +85°C for industrial.................................................................. 250 mA
 +125°C for extended ................................................................. 70 mA
 +85°C for industrial............................................................... 300 mA
 +125°C for extended .............................................................. 95 mA
........................................................................... -0.3V to (V
Preliminary
DIS
= V
DD
x {I
DD
–  I
OH
} +  {(V
PIC16LF1902/3
DD
– V
OH
) x I
DS41455B-page 197
OH
} + (V
DD
+ 0.3V)
O
l x I
OL
).

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