PIC16F726-E/SO Microchip Technology, PIC16F726-E/SO Datasheet - Page 7

• Manufacturer Part Number: PIC16F726-E/SO
• Description: 14KB Flash Program, 1.8V-5.5V, 16MHz Internal Oscillator, 8b ADC, CCP, I2C/SPI,
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F726-E/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 11x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 368 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 3
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 11 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

APPENDIX A:
Rev. A Document (07/2008)
First revision of this document.
Rev. B Document (08/2008)
Added Module 4: Internal Oscillator; Revised Modules
1 and 2.
Rev. C Document (11/2008)
Added Module 5: Internal Oscillator, Module 6: CPU and
Module 7: BOR.
Rev. D Document (07/2009)
Updated document with new format. Added items 1.3
and 3.3. Updated Tables 1 and 2. Other minor changes.
Rev. E Document (09/2009)
Added Module 6: WDT; Revised Tables 1 and 2; Added
Rev. ID AC.
Rev. F Document (01/2010)
Added Rev. AD Silicon.
Rev. G Document (03/2010)
Added new Module 4: External Oscillator; Revised
Table 2; Revised Module 3.3: Frequency Tolerance;
Other minor corrections.
Rev. H Document (04/2010)
Updated Tables 1 and 2, adding Rev. AK silicon;
Updated Module 3, clarified condition.
Rev. J Document (02/2011)
Updated errata to new format; Added Module 8,
Interrupts.
 2011 Microchip Technology Inc.
DOCUMENT
REVISION HISTORY
PIC16(L)F72X
DS80382J-page 7