PIC16F723A-E/ML Microchip Technology, PIC16F723A-E/ML Datasheet - Page 208
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC16F723A-E/ML
Manufacturer Part Number
PIC16F723A-E/ML
Description
7 KB Flash, 1.8V-5.5V, 16 MHz Int. Osc. 28 QFN 6x6mm TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet
1.PIC16F722AT-ISS.pdf
(284 pages)
Specifications of PIC16F723A-E/ML
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F723A-E/ML
Manufacturer:
TI
Quantity:
1 200
- Current page: 208 of 284
- Download datasheet (3Mb)
PIC16F/LF722A/723A
23.5
DS41417A-page 208
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2: T
3: T
Thermal Considerations
P
I
INTERNAL
DD
A
J
T
Sym.
P
P
= Junction Temperature
JMAX
= Ambient Temperature
PD
DER
JA
JC
I
is current to run the chip alone without driving any load on the output pins.
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
+125°C
Typ.
27.5
27.5
31.4
150
60
80
90
24
24
24
24
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= (I
= PD
INTERNAL
2010 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + (I
- T
DD
I
/
O
A
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))
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