PIC16F526-I/ST Microchip Technology, PIC16F526-I/ST Datasheet - Page 83

• Manufacturer Part Number: PIC16F526-I/ST
• Description: 1.5KB Flash Program, 64B Flash Data, 8MHz Internal Oscillator, 8b ADC, 2x Compar
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F526-I/ST

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 11
• Program Memory Size: 1.5KB (1K x 12)
• Program Memory Type: FLASH
• Ram Size: 67 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 3x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

14.0
Absolute Maximum Ratings
Ambient temperature under bias.......................................................................................................... -40°C to +125°C
Storage temperature ............................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR with respect to V
Voltage on all other pins with respect to V
Total power dissipation
Max. current out of V
Max. current into V
Input clamp current, I
Output clamp current, I
Max. output current sunk by any I/O pin .............................................................................................................. 25 mA
Max. output current sourced by any I/O pin ......................................................................................................... 25 mA
Max. output current sourced by I/O port .............................................................................................................. 75 mA
Max. output current sunk by I/O port ................................................................................................................... 75 mA
 2010 Microchip Technology Inc.
†
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows: P
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
ELECTRICAL CHARACTERISTICS
DD
with respect to V
DD
SS
IK
pin ................................................................................................................................... 150 mA
(1)
OK
(V
pin ................................................................................................................................ 200 mA
.................................................................................................................................. 700 mW
I
(V
< 0 or V
O
< 0 or V
SS
I
SS
............................................................................................................... 0 to +6.5V
> V
(†)
..........................................................................................................0 to +13.5V
O
DD
> V
SS
)20 mA
DD
............................................................................... -0.3V to (V
) 20 mA
DIS
= V
DD
x {I
DD
–  I
OH
} +  {(V
DD
PIC16F526
– V
OH
) x I
OH
DS41326E-page 83
} + (V
DD
+ 0.3V)
OL
x I
OL
)