PIC12F519-E/MS Microchip Technology, PIC12F519-E/MS Datasheet - Page 66
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F519-E/MS
Manufacturer Part Number
PIC12F519-E/MS
Description
1.5KB Flash Program, 64B Flash Data, 8MHz Internal Oscillator 8 MSOP 3x3mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F519-ISN.pdf
(96 pages)
2.PIC12F519-ISN.pdf
(4 pages)
3.PIC12F519-ISN.pdf
(22 pages)
Specifications of PIC12F519-E/MS
Core Processor
PIC
Core Size
8-Bit
Speed
8MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
FLASH
Ram Size
41 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
41 B
Interface Type
USB
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
6
Number Of Timers
1
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162096 - HEADER MPLAB ICD2 PIC16F526 8/14AC164325 - MODULE SKT FOR 8MSOP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
PIC12F519
TABLE 11-2:
DS41319B-page 64
DC CHARACTERISTICS
D001
D002
D003
D004
D005
D010
D020
D022
Note 1:
Param
No.
2:
3:
4:
5:
*
V
V
V
S
I
I
I
I
Sym.
DDP
DD
PD
WDT
DD
DR
POR
VDD
These parameters are characterized but not tested.
Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
This is the limit to which V
The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail-to-rail for external clock modes; all I/O pins tri-stated, pulled to
V
For standby current measurements, the conditions are the same as I
mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep.
SS
, T0CKI = V
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current During Prog/
Erase.
Supply Current
Power-down Current
WDT Current
DC CHARACTERISTICS: PIC12F519 (Extended)
DD
DD
Start Voltage to ensure
Rise Rate to ensure
Characteristic
DD
, MCLR = V
(3,4)
DD
DD
(5)
can be lowered in Sleep mode without losing RAM data.
measurements in active operation mode are:
DD
; WDT enabled/disabled as specified.
(2)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature -40°C ≤ T
0.05*
Min.
2.0
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
250*
0.75
0.35
1.5*
Vss
175
400
250
0.1
1.0
7.0
11
38
—
(1)
Max.
15.0
250
700
400
110
5.5
1.2
9.0
24
18
22
—
—
—
—
Units
V/ms
mA
mA
μA
μA
μA
μA
μA
μA
μA
μA
μA
V
V
V
DD
, except that the device is in Sleep
See Figure 11-1
Device in Sleep mode
See Section 8.4 “Power-on
Reset (POR)” for details
See Section 8.4 “Power-on
Reset (POR)” for details
F
F
F
F
F
F
V
V
V
V
OSC
OSC
OSC
OSC
OSC
OSC
A
DD
DD
DD
DD
≤ +125°C (extended)
© 2008 Microchip Technology Inc.
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 4 MHz, V
= 4 MHz, V
= 8 MHz, V
= 8 MHz, V
= 32 kHz, V
= 32 kHz, V
Conditions
DD
DD
DD
DD
DD
DD
= 2.0V
= 5.0V
= 2.0V
= 5.0V
= 2.0V
= 5.0V