OP97FS-REEL Analog Devices Inc, OP97FS-REEL Datasheet - Page 5

• Manufacturer Part Number: OP97FS-REEL
• Description: IC,Operational Amplifier,SINGLE,BIPOLAR,SOP,8PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of OP97FS-REEL

• Rohs Status: RoHS non-compliant
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Slew Rate: 0.2 V/µs
• -3db Bandwidth: 900kHz
• Current - Input Bias: 30pA
• Voltage - Input Offset: 30µV
• Current - Supply: 380µA
• Voltage - Supply, Single/dual (±): ±2 V ~ 20 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Output Type: -
• Current - Output / Channel: -
• Gain Bandwidth Product: -

ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply to both DICE and packaged
parts, unless otherwise noted.
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Differential Input Current
Output Short-Circuit Duration
Operating Temperature Range
OP97E, OP97F (P, S)
Storage Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
1
2
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
For supply voltages less than ±20 V, the absolute maximum input voltage is
The inputs of the OP97 are protected by back-to-back diodes. Current-
equal to the supply voltage.
limiting resistors are not used in order to achieve low noise. Differential
input voltages greater than 1 V cause excessive current to flow through the
input protection diodes unless limiting resistance is used.
1
2
2
±20 V
Indefinite
Rating
±20 V
±1 V
±10 mA
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
300°C
Rev. G | Page 5 of 16
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 4
Package Type
8-Lead PDIP (P Suffix)
8-Lead SOIC (S Suffix)
1
ESD CAUTION
θ
device in socket for PDIP package; θ
printed circuit board for SOIC package.
JA
JA
is specified for the worst-case conditions, that is, a device
is specified for worst-case mounting conditions, that is, θ
.
JA
θ
103
158
is specified for device soldered to
JA
1
θ
43
43
JC
JA
is specified for
Unit
°C/W
°C/W
OP97