MIC4100BM Micrel Inc, MIC4100BM Datasheet - Page 17

• Manufacturer Part Number: MIC4100BM
• Description: IC,Dual MOSFET Driver,SOP,8PIN,PLASTIC
• Manufacturer: Micrel Inc

Specifications of MIC4100BM

• Configuration: Half Bridge
• Input Type: Non-Inverting
• Delay Time: 27ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 118V
• Voltage - Supply: 9 V ~ 16 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

The circuit is configured as a synchronous buck power
stage. The high-side MOSFET drain connects to the input
supply voltage (drain) and the source connects to the
switching node. The low-side MOSFET drain connects to
the switching node and its source is connected to ground.
The buck converter output inductor (not shown) would
connect to the switching node. The high-side drive trace,
HO, is routed on top of its return trace, HS, to minimize
loop area and parasitic inductance. The low-side drive
Micrel, Inc.
March 2006
CIN
Vin (FET Drain)
High-side FET
CB
HS
Cvdd
Vdd
HO
HB
Low-side FET
(FET Source)
GND
MIC4100
LO
Vss
HS Node
(switching node)
LI
HI
Figure 12
17
trace LO is routed over the ground plane which minimizes
the impedance of that current path. The decoupling
capacitors, C
between the capacitors and their respective pins. This
close placement is necessary to efficiently charge
capacitor C
0.025” wide or greater to reduce impedance. Cin is used to
decouple the high current path through the MOSFETs.
GND
B
B
when the HS node is low. All traces are
and C
HO trace
VDD
are placed to minimize etch length
M9999-031506
MIC4100/1