MCP23S09T-E/MG Microchip Technology, MCP23S09T-E/MG Datasheet - Page 39

8-bit Input/Output Expander, SPI Interface 16 QFN 3x3x0.9mm T/R

MCP23S09T-E/MG

Manufacturer Part Number
MCP23S09T-E/MG
Description
8-bit Input/Output Expander, SPI Interface 16 QFN 3x3x0.9mm T/R
Manufacturer
Microchip Technology
Datasheet

Specifications of MCP23S09T-E/MG

Interface
SPI
Number Of I /o
8
Interrupt Output
Yes
Frequency - Clock
10MHz
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3.0
3.1
© 2009 Microchip Technology Inc.
PACKAGING INFORMATION
Package Marking Information
20-Lead SSOP (300 mil)
16-Lead QFN (3x3 mm)
18-Lead PDIP (300 mil)
18-Lead SOIC (300 mil)
Legend: XX...X
Note:
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
EYWW
XXX
NNN
YYWWNNN
YYWWNNN
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
YYWWNNN
Y
YY
WW
NNN
*
e
3
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
MCP23009/MCP23S09
Example:
Example
Example:
Example:
E919
239
256
MCP23009
MCP23009
E/SS^^
E/SO^^
MCP23009
0919256
E/P^^
0919
0919
256
256
e
e
e
3
3
3
e
3
)
DS22121B-page 39

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