MC33887PEK Freescale Semiconductor, MC33887PEK Datasheet - Page 26

• Manufacturer Part Number: MC33887PEK
• Description: H-BRIDGE W/LD CUR FDBK
• Manufacturer: Freescale Semiconductor

performance. The significant feature of these packages is the
exposed pad on which the power die is soldered. When
soldered to a PCB, this pad provides a path for heat flow to
the ambient environment. The more copper area and
thickness on the PCB, the better the power dissipation and
transient behavior will be.
bottom side area of copper is 7.8 cm
(see
26
33887
PACKAGING
SOLDERING INFORMATION
The 33887 packages are designed for thermal
Example Characterization on a double-sided PCB:
Figure
); grid array of 24 vias 0.3 mm in diameter
2
; top surface is 2.7 cm
SOLDERING INFORMATION
PACKAGING
2
.
Top Side
Figure 24. PCB Test Layout
Analog Integrated Circuit Device Data
Freescale Semiconductor
Bottom Side