MZA3216S301A TDK Corporation, MZA3216S301A Datasheet - Page 4

BEAD FERRITE ARRAY 300 OHM 1206

MZA3216S301A

Manufacturer Part Number
MZA3216S301A
Description
BEAD FERRITE ARRAY 300 OHM 1206
Manufacturer
TDK Corporation
Series
MZAr
Datasheet

Specifications of MZA3216S301A

Package / Case
1206 (3216 Metric)
Impedance @ Frequency
300 Ohm @ 100MHz
Current Rating
200mA
Dc Resistance (dcr)
400.0 mOhm Max
Filter Type
Differential Mode - 4 Line Array
Number Of Lines
4
Mounting Type
Surface Mount
Product
Chip Ferrite Beads
Impedance
300 Ohms
Tolerance
25 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
0.4 Ohms
Operating Temperature Range
- 55 C to + 125 C
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
445-3349-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MZA3216S301A
Manufacturer:
TDK Corporation
Quantity:
135
Part Number:
MZA3216S301AT
Manufacturer:
TDK/东电化
Quantity:
20 000
Part Number:
MZA3216S301AT000
Quantity:
12 150
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA2010 Type
FEATURES
• A single MZA series chip provides noise attenuation for four
• Electronic equipment, such as portable products, which
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
• Electroplated terminal electrodes accommodate reflow
• Monolithic structure ensures high reliability.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, DVDs, DSCs, game machines, digital photo frames, PNDs,
etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
(5) Characteristic type
(6) Packaging style
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
• This product does not apply to flow soldering construction
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MZA 2010 D 121 C T
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1)
lines, making it ideal for use with I/O lines of various highly
miniaturized.
comprise high density circuitry.
wasteful power consumption.
soldering.
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
method.
121:120Ω at 100MHz
T:Taping
(2) (3) (4) (5) (6)
MATERIAL CHARACTERISTICS
B material: This type is perfectly suited for fast digital signals. By
S material: Standard type that features impedance characteristics
Y material: High frequency range type intended for the 100MHz
D material: For applications calling for low insertion loss at low fre-
F material: This new product inherits the characteristic of our D-
TYPICAL MATERIAL CHARACTERISTICS
2000
1800
1600
1400
1200
1000
800
600
400
200
0
10
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (300MHz to 1GHz) for signal line applica-
tions.
material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres-
sion from 600MHz to as high as in the GHz range.
B
S
Frequency(MHz)
100
001-02 / 20101125 / e9421_mza
Y
Conformity to RoHS Directive
D
F
1000
(3/6)

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