MZA3216S601A TDK Corporation, MZA3216S601A Datasheet - Page 2

• Manufacturer Part Number: MZA3216S601A
• Description: BEAD FERRITE ARRAY 600 OHM 1206
• Manufacturer: TDK Corporation
• Series: MZAr

Specifications of MZA3216S601A

• Package / Case: 1206 (3216 Metric)
• Impedance @ Frequency: 600 Ohm @ 100MHz
• Current Rating: 200mA
• Dc Resistance (dcr): 500.0 mOhm Max
• Filter Type: Differential Mode - 4 Line Array
• Number Of Lines: 4
• Mounting Type: Surface Mount
• Product: Chip Ferrite Beads
• Impedance: 600 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.5 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 445-3350-2

Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA1210 Type
FEATURES
• A single MZA series chip provides noise attenuation for two
• Electronic equipment, such as portable products, which
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
• Electroplated terminal electrodes accommodate reflow
• Monolithic structure ensures high reliability.
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, DVDs, DSCs, game machines, digital photo frames, PNDs,
etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
(5) Characteristic type
(6) Packaging style
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
• This product does not apply to flow soldering construction
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MZA 1210 D 121 C T
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1)
lines, making it ideal for use with I/O lines of various highly
miniaturized.
comprise high density circuitry.
wasteful power consumption.
soldering.
soldering.
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
method.
121:120Ω at 100MHz
T:Taping
(2) (3) (4) (5) (6)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
CIRCUIT DIAGRAM
TEMPERATURE RANGES
Operating/storage
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• No polarity
250 to 260˚C
230˚C
180˚C
150˚C
0.35±0.15 0.35±0.15
1.25±0.15
0.65±0.10
Preheating
60 to 120s
Time(s)
–55 to +125°C
Quantity
5000 pieces/reel
Soldering
10s max.
30 to 60s
Weight: 3mg
Dimensions in mm
001-02 / 20101125 / e9421_mza
Conformity to RoHS Directive
Natural
cooling
0.4
0.3
(1/6)