MPZ2012S601A TDK Corporation, MPZ2012S601A Datasheet - Page 10

• Manufacturer Part Number: MPZ2012S601A
• Description: FERRITE CHIP BEAD 600 OHM SMD
• Manufacturer: TDK Corporation
• Series: MPZr

Specifications of MPZ2012S601A

• Package / Case: 0805 (2012 Metric)
• Impedance @ Frequency: 600 Ohm @ 100MHz
• Current Rating: 2A
• Dc Resistance (dcr): 100.0 mOhm Max
• Filter Type: Differential Mode - Single
• Number Of Lines: 1
• Mounting Type: Surface Mount
• Shielding: Unshielded
• Test Frequency: 100 MHz
• Impedance: 600 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 2 Amps
• Maximum Dc Resistance: 0.1 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 445-2206-2; MPZ2012S601AT

Chip Beads(SMD)
For Power Line
MPZ Series MPZ2012 Type
FEATURES
• The MPZ series are multilayer chip impeders for power supply
• High miniaturized, these parts nonetheless exhibit low DC
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1)Series name
(2)Dimensions L×W
(3)Material code
(4)Nominal impedance
(5)Characteristic type
(6)Packaging style
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
MPZ 2012 S 331 A T
(1)
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
line applications.
resistance and high current handling capability.
soldering.
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
331: 330Ω at 100MHz
T: Taping
(2) (3) (4) (5) (6)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
TEMPERATURE RANGES
Operating/storage
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260˚C
230˚C
180˚C
150˚C
2.0 ±0.2
0.5±0.3
Preheating
60 to 120s
Time(s)
0.8
–55 to +125°C
Quantity
4000 pieces/reel
Soldering
10s max.
30 to 60s
1
0.8
001-03 / 20101210 / e9413_mpz
Conformity to RoHS Directive
Natural
cooling
Weight: 8mg
Dimensions in mm
(9/10)