CKD110JB1E470S TDK Corporation, CKD110JB1E470S Datasheet - Page 15

• Manufacturer Part Number: CKD110JB1E470S
• Description: CAP FEEDTHRU 47PF 25V 1205
• Manufacturer: TDK Corporation
• Series: CKDr

Specifications of CKD110JB1E470S

• Capacitance: 47pF
• Voltage: 25V
• Current: 200mA
• Dc Resistance (dcr): 600.0 mOhm Max
• Package / Case: 0.126" L x 0.049" W x 0.033" H (3.20mm x 1.25mm x 0.85mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Operating Temperature: -
• Other names: 445-3000-2

Series
Series
CKD510JB, CKD110JB, CKD310JB
CKD710JB
CKD510JB
CKD110JB
CKD310JB
• Recommended Soldering Land Pattern
CKD610JB
• All specifications are subject to change without notice. Please read the precautions before using the product.
Symbol
Symbol
Resist
Resist
Soldering
Information
CKD710JB
CKD610JB
a
b
c
c
b
a
0.19
a
b
c
0.5
1.4
1.4
0.4
a
a
Cu Pattern
Cu Pattern
Through hole
Through hole
φ0.4～0.6
Ø0.4-0.6
Through hole
0.7
1.5
2.5
2.5
1.2
b
b
Ø0.4-0.6
d e
d
d
e
e
Connect to the ground pattern
of the chip mounted side.
1.3
2.6
4.5
4.5
2.2
c
c
No Pattern
Back side:
Back side shall be
connected to the ground
pattern of the chip
mounted side. Please
design the back side
ground as large as
possible.
*If through hole is too big,
solder paste may come
into the hole and make
bad connection with the
ground pattern.
Connect to the ground
pattern of the chip
mounted side.
“Through hole” should be
designed as close to
GND terminal as
possible.
0.6
1.0
1.0
1.2
0.7
d
Ground pattern
d
CKD Series — Feed Through Capacitors
0.75
2.0
2.0
2.4
1.4
e
e
US Catalog // CKD Series — Low ESL Feed Through Capacitors// Version A11
Peak
Temp
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Profile
• Recommended Soldering Profile
• Recommended Solder Amount
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Over 60 sec.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
∆T
Soldering
Preheating
Method
Reflow Soldering
Temp./
Peak Temp time
Dura.
Soldering Natural
cooling
Peak temp
230 max.
260 max.
(°C)
Temperature (ºC)
Reflow Soldering
300
∆T ≤ 150
∆T ≤ 150
0
Duration
20 max.
10 max.
∆T
(sec.)
Manual soldering
Preheating
(Solder iron)
Minimum amount
Maximum amount
Higher tensile force
on the chip
capacitor may
cause cracking.
Small solder fillet
may cause contact
failure or failure to
hold the chip
capacitor to the
P.C. board.
3sec. (As short as possible)